Apparatus for electro-forming and apparatus for horizontal electro-forming

An apparatus comprising:

• a plating bath configured to receive a substrate to be plated;
• a clamp disposed within the plating bath and configured to grasp the substrate disposed in a first direction;
• an assembly including:
• an anode spaced above the plating bath and electrically connected to an external power supply, the anode having a first end surface facing the plating bath;
• a plating solution supply spaced above the substrate and configured to supply a plating solution;
• and
• an insulator between the anode and the plating solution supply, the insulator being formed as a distinct structure separate from the anode and the plating solution supply, the insulator having a first end surface facing the plating bath;
• and
• a driving structure configured to reciprocate the assembly in the first direction at a distance from the substrate,
• wherein the first end surface of the anode and the first end surface of the insulator are coplanar with each other.