B81C 2203/01
Packaging mems
Official title: Packaging MEMS
B81C2203/01 (Packaging mems) appears on 1,866 US grants and 2,262 published applications in this corpus.
Search patents in B81C- Granted patents
- 1,866
- Published applications
- 2,262
- Assignees
- 514
- Inventors
- 2,990
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 8 | 0 |
| 1999 | 7 | 0 |
| 2000 | 6 | 0 |
| 2001 | 6 | 4 |
| 2002 | 17 | 28 |
| 2003 | 12 | 36 |
| 2004 | 35 | 68 |
| 2005 | 46 | 100 |
| 2006 | 58 | 78 |
| 2007 | 42 | 84 |
| 2008 | 47 | 80 |
| 2009 | 54 | 72 |
| 2010 | 72 | 87 |
| 2011 | 78 | 111 |
| 2012 | 62 | 93 |
| 2013 | 83 | 95 |
| 2014 | 102 | 117 |
| 2015 | 123 | 137 |
| 2016 | 120 | 151 |
| 2017 | 153 | 167 |
| 2018 | 119 | 120 |
| 2019 | 112 | 106 |
| 2020 | 126 | 123 |
| 2021 | 90 | 82 |
| 2022 | 70 | 71 |
| 2023 | 66 | 74 |
| 2024 | 54 | 65 |
| 2025 | 58 | 63 |
| 2026 | 35 | 50 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81C 2203/0118Bonding a wafer on the substrate, i.e. where the cap consists ofIndexing code625
- B81C 2203/0172SealsIndexing code481
- B81C 2203/0109Bonding an individual cap on the substrateIndexing code466
- B81C 2203/0145Hermetically sealing an opening in the lidIndexing code349
- B81C 2203/0136Growing or depositing of a covering layerIndexing code328
- B81C 2203/0154Moulding a cap over the mems deviceIndexing code187
- B81C 2203/0127Using a carrier for applying a plurality of packaging lids to theIndexing code49
- B81C 2203/0163Reinforcing a capIndexing code33
Recent patents
- Method for producing a micromechanical device comprising a cavity having a melt seal29 Sep 2026US 12,747,156 B2Robert Bosch GmbH
- MEMS device with an improved cap and related manufacturing process8 Sep 2026US 12,729,110 B2STMicroelectronics S,r.l.
- Process for manufacturing a micro-electro-mechanical device including two chambers at different pressures and related micro-electro-mechanical device1 Sep 2026US 12,722,969 B2STMicroelectronics S,r.l.
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- Through-substrate conductor support11 Aug 2026US 12,703,625 B2Texas Instruments Incorporated
- Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device8 Oct 2026US 2026/0307982 A1Hefei Smat Technology Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices1 Oct 2026US 2026/0296878 A1Amkor Technology Singapore Holding Pte. Ltd.
- Deformation Bonded and Hermetically Sealed Vacuum MEMS Cells with Stopping Layer17 Sep 2026US 2026/0274653 A1HRL Laboratories, LLC
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Micromechanical component for a sensor device, microphone device and/or micro-loudspeaker device27 Aug 2026US 2026/0250121 A1
Most cited
By later US patents
- Method for fabricating a structure for a microelectromechanical systems (MEMS) device722US 6,794,119 B2Iridigm Display Corporation · 2004
- Hermetic seal and method to create the same666US 6,589,625 B1Iridigm Display Corporation · 2003
- Method for forming micro cavity560US 6,342,427 B12002
- Method of room temperature covalent bonding315US 7,109,092 B2Ziptronix, Inc. · 2006
- Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips273US 9,368,429 B2Intel Corporation · 2016