B81C 2203/0118
Bonding a wafer on the substrate, i.e. where the cap consists of
Official title: Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
B81C2203/0118 (Bonding a wafer on the substrate, i.e. where the cap consists of) appears on 625 US grants and 754 published applications in this corpus.
Search patents in B81C- Granted patents
- 625
- Published applications
- 754
- Assignees
- 238
- Inventors
- 1,164
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 2 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 4 | 10 |
| 2003 | 1 | 7 |
| 2004 | 10 | 17 |
| 2005 | 16 | 48 |
| 2006 | 20 | 22 |
| 2007 | 19 | 28 |
| 2008 | 14 | 26 |
| 2009 | 18 | 22 |
| 2010 | 14 | 25 |
| 2011 | 30 | 29 |
| 2012 | 23 | 32 |
| 2013 | 18 | 23 |
| 2014 | 29 | 50 |
| 2015 | 40 | 35 |
| 2016 | 41 | 55 |
| 2017 | 67 | 65 |
| 2018 | 38 | 38 |
| 2019 | 46 | 41 |
| 2020 | 35 | 46 |
| 2021 | 32 | 23 |
| 2022 | 27 | 24 |
| 2023 | 21 | 29 |
| 2024 | 21 | 22 |
| 2025 | 22 | 21 |
| 2026 | 14 | 15 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for producing a micromechanical device comprising a cavity having a melt seal29 Sep 2026US 12,747,156 B2Robert Bosch GmbH
- Process for manufacturing a micro-electro-mechanical device including two chambers at different pressures and related micro-electro-mechanical device1 Sep 2026US 12,722,969 B2STMicroelectronics S,r.l.
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- Through-substrate conductor support11 Aug 2026US 12,703,625 B2Texas Instruments Incorporated
- Method and device for locally removing and/or modifying a polymer material on a surface28 Apr 2026US 12,612,305 B2Robert Bosch GmbH
- Manufacturing method for microelectromechanical devices and microelectromechanical device thereof20 Aug 2026US 2026/0242211 A1STMicroelectronics International N. V.
- Manufacturing process of a microelectromechanical system with multiple cavities at different pressures and related microelectromechanical system20 Aug 2026US 2026/0242215 A1STMicroelectronics International N. V.
- System and Method for Wafer Level Hermetic Packaging of Optical Microelectromechanical System20 Aug 2026US 2026/0243127 A1Silicon Light Machines Corporation
- Method for eutectic sealing of two substrates16 Jul 2026US 2026/0206640 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Cmos ultrasonic transducers and related apparatus and methods9 Jul 2026US 2026/0192332 A1Bfly Operations, Inc.
Most cited
By later US patents
- Method of room temperature covalent bonding315US 7,109,092 B2Ziptronix, Inc. · 2006
- Method of room temperature covalent bonding215US 8,841,002 B2Ziptronix, Inc. · 2014
- Lid wafer bond packaging and micromachining205US 5,915,168 AHarris Corporation · 1999
- Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates178US 6,815,739 B2Corporation for National Research Initiatives · 2004
- Vertically integrated MEMS structure with electronics in a hermetically sealed cavity172US 7,104,129 B2InvenSense, Inc. · 2006