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US 7,104,129 B2Granted
Vertically integrated MEMS structure with electronics in a hermetically sealed cavity
AssigneeInvenSense, Inc.
InventorsSteven S. Nasiri, Anthony Francis Flannery, Jr.
Life of this patent
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Abstract
A MEMS assembly having a MEMS subassembly sandwiched between and bonded to a cap and a base is provided. The MEMS subassembly includes at least one MEMS device element flexibly connected to the MEMS assembly. The vertical separation between the MEMS device element and an electrode on the base is lithographically defined. Precise control of this critical vertical gap dimension is thereby provided.
Claims18
A vertically integrated microelectromechanical (MEMS) assembly comprising:
- a MEMS subassembly including a substantially planar frame and at least one MEMS device element within the frame and flexibly connected to the assembly;
- a cap bonded to the frame with a first bond, the first bond being substantially parallel to the frame;
- and
- a base bonded to a surface of the frame facing away from the cap with a second bond;
- wherein a gap between an electrode on the base and the MEMS device element is defined by a lithographic feature on the frame;
- whereby precise control of the gap is provided and the at least one MEMS device element is enclosed within a cavity.
3 more elements
Dependencies are inferred from the claim text.