B81C 2203/00
Forming microstructural systems
B81C2203/00 (Forming microstructural systems) appears on 3,141 US grants and 3,737 published applications in this corpus.
Search patents in B81C- Granted patents
- 3,141
- Published applications
- 3,737
- Assignees
- 857
- Inventors
- 4,912
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 4 | 0 |
| 1995 | 2 | 0 |
| 1996 | 7 | 0 |
| 1997 | 7 | 0 |
| 1998 | 20 | 0 |
| 1999 | 15 | 0 |
| 2000 | 22 | 0 |
| 2001 | 18 | 8 |
| 2002 | 35 | 50 |
| 2003 | 38 | 56 |
| 2004 | 57 | 99 |
| 2005 | 65 | 128 |
| 2006 | 76 | 122 |
| 2007 | 64 | 119 |
| 2008 | 69 | 119 |
| 2009 | 72 | 131 |
| 2010 | 117 | 141 |
| 2011 | 119 | 173 |
| 2012 | 112 | 151 |
| 2013 | 133 | 153 |
| 2014 | 165 | 197 |
| 2015 | 186 | 228 |
| 2016 | 207 | 249 |
| 2017 | 232 | 260 |
| 2018 | 202 | 225 |
| 2019 | 199 | 187 |
| 2020 | 220 | 208 |
| 2021 | 155 | 143 |
| 2022 | 130 | 140 |
| 2023 | 114 | 137 |
| 2024 | 96 | 120 |
| 2025 | 109 | 109 |
| 2026 | 67 | 84 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for producing a micromechanical device comprising a cavity having a melt seal29 Sep 2026US 12,747,156 B2Robert Bosch GmbH
- Method of fabricating micro-electromechanical system device22 Sep 2026US 12,741,865 B2Vanguard International Semiconductor Corporation
- MEMS device with an improved cap and related manufacturing process8 Sep 2026US 12,729,110 B2STMicroelectronics S,r.l.
- Process for manufacturing a micro-electro-mechanical device including two chambers at different pressures and related micro-electro-mechanical device1 Sep 2026US 12,722,969 B2STMicroelectronics S,r.l.
- Resonance device with anti-diffusion layer and resonance device manufacturing method25 Aug 2026US 12,719,443 B2Murata Manufacturing Co., Ltd.
- Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device8 Oct 2026US 2026/0307982 A1Hefei Smat Technology Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices1 Oct 2026US 2026/0296878 A1Amkor Technology Singapore Holding Pte. Ltd.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Wafer level proximity sensor and method of making same1 Oct 2026US 2026/0296880 A1STMicroelectronics International N. V.
- Manufacturing a microphone by bonding layers1 Oct 2026US 2026/0296881 A1InvenSense, Inc.
Most cited
By later US patents
- Method for fabricating a structure for a microelectromechanical systems (MEMS) device722US 6,794,119 B2Iridigm Display Corporation · 2004
- Hermetic seal and method to create the same666US 6,589,625 B1Iridigm Display Corporation · 2003
- Method for forming micro cavity560US 6,342,427 B12002
- Heterogeneously integrated microsystem-on-a-chip337US 7,335,972 B2Sandia Corporation · 2008
- Method of room temperature covalent bonding315US 7,109,092 B2Ziptronix, Inc. · 2006