B81C 2203/03
Bonding two components
B81C2203/03 (Bonding two components) appears on 886 US grants and 1,136 published applications in this corpus.
Search patents in B81C- Granted patents
- 886
- Published applications
- 1,136
- Assignees
- 406
- Inventors
- 1,953
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 4 | 0 |
| 1997 | 1 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 3 |
| 2002 | 9 | 16 |
| 2003 | 13 | 12 |
| 2004 | 15 | 16 |
| 2005 | 10 | 24 |
| 2006 | 18 | 33 |
| 2007 | 8 | 27 |
| 2008 | 14 | 19 |
| 2009 | 11 | 31 |
| 2010 | 25 | 29 |
| 2011 | 20 | 29 |
| 2012 | 22 | 48 |
| 2013 | 19 | 26 |
| 2014 | 37 | 48 |
| 2015 | 35 | 42 |
| 2016 | 39 | 66 |
| 2017 | 55 | 69 |
| 2018 | 62 | 86 |
| 2019 | 64 | 86 |
| 2020 | 79 | 93 |
| 2021 | 76 | 67 |
| 2022 | 63 | 61 |
| 2023 | 47 | 68 |
| 2024 | 43 | 49 |
| 2025 | 46 | 48 |
| 2026 | 37 | 40 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method of fabricating micro-electromechanical system device22 Sep 2026US 12,741,865 B2Vanguard International Semiconductor Corporation
- MEMS device with an improved cap and related manufacturing process8 Sep 2026US 12,729,110 B2STMicroelectronics S,r.l.
- Resonance device with anti-diffusion layer and resonance device manufacturing method25 Aug 2026US 12,719,443 B2Murata Manufacturing Co., Ltd.
- Integrated dicing die bonding sheet and method for producing semiconductor device25 Aug 2026US 12,721,105 B2Dow Toray Co., Ltd.
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Wafer level proximity sensor and method of making same1 Oct 2026US 2026/0296880 A1STMicroelectronics International N. V.
- Manufacturing a microphone by bonding layers1 Oct 2026US 2026/0296881 A1InvenSense, Inc.
- Foundry-compatible process for integrated micro-speaker and microphone17 Sep 2026US 2026/0281642 A1Vibrant Microsystems Inc.
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
Most cited
By later US patents
- Method of fabricating suspended microstructures245US 6,465,355 B1Hewlett-Packard Company · 2002
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Decal transfer lithography220US 7,662,545 B2The Board of Trustees of the University of Illinois · 2010
- Bonded structures181US 10,002,844 B1Invensas Bonding Technologies, Inc. · 2018
- Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates178US 6,815,739 B2Corporation for National Research Initiatives · 2004