B81C 2203/038
Bonding techniques not provided for in b81c2203/031 - b81c2203/037
Official title: Bonding techniques not provided for in B81C2203/031 - B81C2203/037
B81C2203/038 (Bonding techniques not provided for in b81c2203/031 - b81c2203/037) appears on 112 US grants and 160 published applications in this corpus.
Search patents in B81C- Granted patents
- 112
- Published applications
- 160
- Assignees
- 80
- Inventors
- 273
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 4 |
| 2003 | 2 | 3 |
| 2004 | 5 | 6 |
| 2005 | 1 | 5 |
| 2006 | 6 | 8 |
| 2007 | 1 | 10 |
| 2008 | 1 | 2 |
| 2009 | 1 | 9 |
| 2010 | 6 | 3 |
| 2011 | 6 | 4 |
| 2012 | 3 | 6 |
| 2013 | 2 | 1 |
| 2014 | 5 | 7 |
| 2015 | 4 | 9 |
| 2016 | 3 | 11 |
| 2017 | 9 | 7 |
| 2018 | 6 | 10 |
| 2019 | 6 | 6 |
| 2020 | 11 | 11 |
| 2021 | 9 | 8 |
| 2022 | 5 | 4 |
| 2023 | 2 | 9 |
| 2024 | 4 | 8 |
| 2025 | 6 | 7 |
| 2026 | 5 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- MEMS device with an improved cap and related manufacturing process8 Sep 2026US 12,729,110 B2STMicroelectronics S,r.l.
- Decoupling method for semiconductor device23 Jun 2026US 12,662,371 B2STMicroelectronics International N. V.
- Dual micro-electro mechanical system and manufacturing method thereof7 Apr 2026US 12,595,167 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Production method for a micromechanical component for a sensor device or microphone device31 Mar 2026US 12,589,988 B2Robert Bosch GmbH
- Component with microfluidic structures, method for the production and use thereof10 Feb 2026US 12,544,753 B2Joanneum Research Forschungsgesellschaft mbH
- Dual micro-electro mechanical system and manufacturing method thereof23 Jul 2026US 2026/0209033 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Mems pressure transducer wafer-level chip-scale package and method for producing the same14 May 2026US 2026/0132018 A1Infineon Technologies AG
- Seal for microelectronic assembly6 Nov 2025US 2025/0343086 A1Adeia Semiconductor Bonding Technologies Inc.
- Package for multiple loudspeakers16 Oct 2025US 2025/0320114 A1STMicroelectronics International N. V.
- Mems devices singulated by plasma etch16 Oct 2025US 2025/0320115 A1
Most cited
By later US patents
- Decal transfer lithography220US 7,662,545 B2The Board of Trustees of the University of Illinois · 2010
- Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom155US 7,442,570 B2Invensence Inc. · 2008
- Bonded structures150US 10,522,499 B2Invensas Bonding Technologies, Inc. · 2019
- Seal for microelectronic assembly142US 10,508,030 B2Invensas Bonding Technologies, Inc. · 2019
- Bonded structures133US 11,004,757 B2Invensas Bonding Technologies, Inc. · 2021