Mems pressure transducer wafer-level chip-scale package and method for producing the same

A method for manufacturing a MEMS pressure transducer Wafer-Level Chip-Scale Package, the method comprising:

• providing a MEMS wafer having a front side and an opposite back side, the front side comprising a plurality of adjacently arranged MEMS membrane structures being embedded in an embedding material layer,
• providing an ASIC wafer having a front side and an opposite back side, the front side comprising a plurality of adjacently arranged integrated electronic components for transducing a membrane oscillation into an electric signal,
• bonding the MEMS wafer with the ASIC wafer with their respective front sides facing each other,
• structuring at least one first cavity into the backside of the MEMS wafer and structuring a smaller second cavity into the first cavity, said smaller second cavity being positioned opposite of at least one of the plurality of adjacently arranged MEMS membrane structures,
• releasing said at least one MEMS membrane structure by removing the embedding material layer through the second cavity,
• providing a lid wafer and bonding said lid wafer onto the back side of the MEMS wafer for covering the first cavity, and
• singulating the MEMS pressure transducer Wafer-Level Chip-Scale Package by dicing around the covered first cavity.