Production method for a micromechanical component for a sensor device or microphone device

A production method for a micromechanical component for a sensor device or microphone device, the method comprising the following steps:

• forming a supporting structure including a first sacrificial material on a substrate surface of a substrate, the supporting structure being formed using a first sacrificial material layer including the first sacrificial material at least partially covering the substrate surface, the sacrificial material layer including a plurality of etching holes structured through the first sacrificial material layer, and using a plurality of supporting posts including the first sacrificial material projecting into the substrate;
• etching into the substrate surface at least one cavity spanned by the supporting structure using an etchant passed through the plurality of etching holes in the first sacrificial material layer, the first sacrificial material having a higher etch resistance to the etchant than the substrate;
• forming a diaphragm including at least one semiconductor material on or over the first sacrificial material layer of the supporting structure;
• depositing a layer stack on a side of the diaphragm facing away from the substrate, the layer stack including at least one sacrificial layer and at least one counter electrode formed on a side of the at least one sacrificial layer facing away from the diaphragm;
• and
• exposing the diaphragm by at least partially removing at least the supporting structure and the at least one sacrificial layer.