B81C 2203/033
Thermal bonding
B81C2203/033 (Thermal bonding) appears on 544 US grants and 699 published applications in this corpus.
Search patents in B81C- Granted patents
- 544
- Published applications
- 699
- Assignees
- 239
- Inventors
- 1,136
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 6 | 7 |
| 2003 | 8 | 4 |
| 2004 | 5 | 8 |
| 2005 | 4 | 5 |
| 2006 | 5 | 11 |
| 2007 | 2 | 19 |
| 2008 | 7 | 7 |
| 2009 | 1 | 5 |
| 2010 | 7 | 8 |
| 2011 | 6 | 16 |
| 2012 | 7 | 24 |
| 2013 | 9 | 19 |
| 2014 | 21 | 32 |
| 2015 | 21 | 23 |
| 2016 | 36 | 45 |
| 2017 | 41 | 55 |
| 2018 | 44 | 53 |
| 2019 | 45 | 58 |
| 2020 | 60 | 72 |
| 2021 | 47 | 41 |
| 2022 | 40 | 42 |
| 2023 | 34 | 45 |
| 2024 | 29 | 33 |
| 2025 | 32 | 37 |
| 2026 | 20 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Resonance device with anti-diffusion layer and resonance device manufacturing method25 Aug 2026US 12,719,443 B2Murata Manufacturing Co., Ltd.
- Stacked die package and methods of forming the same23 Jun 2026US 12,667,009 B2Qorvo US, Inc.
- Process flow for thin contactless thermal sensors16 Jun 2026US 12,656,179 B2STMicroelectronics International N. V.
- Foundry-compatible process for integrated micro-speaker and microphone26 May 2026US 12,641,387 B2Vibrant Microsystems Inc.
- Inertial sensor and method for forming the same19 May 2026US 12,631,453 B2AAC Technologies PTE.Ltd.
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Manufacturing a microphone by bonding layers1 Oct 2026US 2026/0296881 A1InvenSense, Inc.
- Foundry-compatible process for integrated micro-speaker and microphone17 Sep 2026US 2026/0281642 A1Vibrant Microsystems Inc.
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
- Micromechanical sensor device and corresponding production method3 Sep 2026US 2026/0257909 A1
Most cited
By later US patents
- Method of fabricating suspended microstructures245US 6,465,355 B1Hewlett-Packard Company · 2002
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Bonded structures181US 10,002,844 B1Invensas Bonding Technologies, Inc. · 2018
- Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates178US 6,815,739 B2Corporation for National Research Initiatives · 2004
- Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom155US 7,442,570 B2Invensence Inc. · 2008