B81C 2203/036
Fusion bonding
B81C2203/036 (Fusion bonding) appears on 262 US grants and 330 published applications in this corpus.
Search patents in B81C- Granted patents
- 262
- Published applications
- 330
- Assignees
- 137
- Inventors
- 531
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 5 | 3 |
| 2003 | 4 | 2 |
| 2004 | 4 | 5 |
| 2005 | 3 | 3 |
| 2006 | 1 | 6 |
| 2007 | 2 | 17 |
| 2008 | 6 | 4 |
| 2009 | 1 | 2 |
| 2010 | 6 | 5 |
| 2011 | 1 | 5 |
| 2012 | 1 | 9 |
| 2013 | 3 | 6 |
| 2014 | 8 | 16 |
| 2015 | 9 | 6 |
| 2016 | 18 | 17 |
| 2017 | 14 | 19 |
| 2018 | 16 | 22 |
| 2019 | 19 | 19 |
| 2020 | 27 | 40 |
| 2021 | 21 | 21 |
| 2022 | 16 | 23 |
| 2023 | 21 | 29 |
| 2024 | 15 | 16 |
| 2025 | 23 | 20 |
| 2026 | 11 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Process flow for thin contactless thermal sensors16 Jun 2026US 12,656,179 B2STMicroelectronics International N. V.
- Foundry-compatible process for integrated micro-speaker and microphone26 May 2026US 12,641,387 B2Vibrant Microsystems Inc.
- Methods of manufacturing plasma generating cells for a plasma source14 Apr 2026US 12,601,621 B2APPLIED Materials.Inc.
- Sensor assembly and methods of manufacturing thereof17 Feb 2026US 12,553,751 B2APPLIED Materials.Inc.
- Packaging for a sensor and methods of manufacturing thereof17 Feb 2026US 12,553,752 B2APPLIED Materials.Inc.
- Manufacturing a microphone by bonding layers1 Oct 2026US 2026/0296881 A1InvenSense, Inc.
- Foundry-compatible process for integrated micro-speaker and microphone17 Sep 2026US 2026/0281642 A1Vibrant Microsystems Inc.
- Asic capped mems device20 Aug 2026US 2026/0242209 A1Murata Manufacturing Co., Ltd.
- Asic capped double layer mems platform20 Aug 2026US 2026/0242213 A1Murata Manufacturing Co., Ltd.
- Methods of manufacturing plasma generating cells for a plasma source16 Jul 2026US 2026/0202227 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Method of fabricating suspended microstructures245US 6,465,355 B1Hewlett-Packard Company · 2002
- Bonded structures150US 10,522,499 B2Invensas Bonding Technologies, Inc. · 2019
- Microfabricated structures with trench-isolation using bonded-substrates and cavities150US 6,433,401 B1Analog Devices IMI, Inc. · 2002
- Micromachined ultrasonic transducers and method of fabrication148US 6,958,255 B2The Board of Trustees of the Leland Stanford Junior University · 2005
- Seal for microelectronic assembly142US 10,508,030 B2Invensas Bonding Technologies, Inc. · 2019