B81C 2203/037
Thermal bonding techniques not provided for in b81c2203/035 - b81c2203/036
Official title: Thermal bonding techniques not provided for in B81C2203/035 - B81C2203/036
B81C2203/037 (Thermal bonding techniques not provided for in b81c2203/035 - b81c2203/036) appears on 77 US grants and 120 published applications in this corpus.
Search patents in B81C- Granted patents
- 77
- Published applications
- 120
- Assignees
- 61
- Inventors
- 217
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2007 | 0 | 10 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 1 | 3 |
| 2014 | 2 | 2 |
| 2015 | 1 | 2 |
| 2016 | 5 | 10 |
| 2017 | 5 | 14 |
| 2018 | 12 | 13 |
| 2019 | 7 | 9 |
| 2020 | 12 | 16 |
| 2021 | 9 | 8 |
| 2022 | 8 | 9 |
| 2023 | 4 | 2 |
| 2024 | 4 | 4 |
| 2025 | 3 | 6 |
| 2026 | 4 | 10 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Inertial sensor and method for forming the same19 May 2026US 12,631,453 B2AAC Technologies PTE.Ltd.
- Hermetically sealed glass package7 Apr 2026US 12,595,169 B2Schott AG
- Inter-poly connection for parasitic capacitor and die size improvement24 Mar 2026US 12,583,740 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Generating a MEMS device with glass cover and MEMS device27 Jan 2026US 12,534,360 B2Infineon Technologies AG
- Process and apparatus for the preparation of a bonded substrate14 Oct 2025US 12,441,608 B2Sherkin Technologies Limited
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Micromechanical sensor device and corresponding production method3 Sep 2026US 2026/0257909 A1
- Micro-electro-mechanical system package20 Aug 2026US 2026/0242212 A1Vanguard International Semiconductor Corporation
- Manufacturing process of a microelectromechanical system with multiple cavities at different pressures and related microelectromechanical system20 Aug 2026US 2026/0242215 A1STMicroelectronics International N. V.
- Method for eutectic sealing of two substrates16 Jul 2026US 2026/0206640 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
Most cited
By later US patents
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Wafer encapsulated microelectromechanical structure and method of manufacturing same16US 8,871,551 B2SiTime Corporation · 2014
- Lid and method for sealing a non-magnetic package8US 10,196,745 B2General Electric Company · 2019
- Inter-poly connection for parasitic capacitor and die size improvement4US 10,155,656 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2018
- MEMS device formed by at least two bonded structural layers and manufacturing process thereof3US 10,227,233 B2STMicroelectronics S,r.l. · 2019