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US 10,196,745 B2Granted
Lid and method for sealing a non-magnetic package
AssigneeGeneral Electric Company
InventorsChristopher Kapusta, Marco Francesco Aimi
Life of this patent
Estimating the term…
Abstract
A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has a gold/tin solder preform attached to a sealing surface of the lid.
Claims29
A metallic non-magnetic lid for sealing a hermetic package comprising:
- a substrate consisting of molybdenum;
- an adhesion layer on the substrate;
- a copper seed layer on the adhesion layer;
- a palladium solder base layer;
- and
- a gold/tin solder preform attached at a sealing surface of the lid.
3 more elements
A metallic, seam-sealable non-magnetic lid for sealing a hermetic package comprising:
- a substrate consisting of molybdenum;
- an adhesion layer deposited onto at least one surface of the substrate;
- a copper seed layer deposited onto the adhesion layer;
- a palladium solder base layer deposited onto the copper seed layer;
- and
- a gold/tin solder preform attached to the palladium solder base layer at a sealing surface of the lid.
3 more elements
Dependencies are inferred from the claim text.