Resonance device with anti-diffusion layer and resonance device manufacturing method
AssigneeMurata Manufacturing Co., Ltd.
InventorsYoshiyuki Higuchi, Masakazu Fukumitsu
Life of this patent
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Abstract
A resonance device that includes a MEMS substrate, a top cover, and a bonding part. The MEMS substrate includes a resonator. The bonding part is electrically conductive and bonds the MEMS substrate and the top cover to each other. The MEMS substrate further includes a wiring line layer and an anti-diffusion layer. The wiring line layer is electrically connected to a Si substrate serving as a lower electrode of the resonator. The anti-diffusion layer electrically connects the wiring line layer and the bonding part to each other.
Claims18
A resonance device comprising:
- a first substrate that includes a resonator having a lower electrode and a wiring line layer electrically connected to the lower electrode;
- a second substrate;
- a bonding part that is electrically conductive, bonds the first substrate and the second substrate to each other and is electrically connected to a ground reference potential of the resonance device;
- and
- an anti-diffusion layer electrically connecting the wiring line layer and the bonding part to each other.
A resonance device manufacturing method comprising:
- preparing a first substrate including a first metal layer, a resonator, a wiring line layer electrically connected to a lower electrode of the resonator, and an anti-diffusion layer electrically connecting the wiring line layer to the first metal layer;
- preparing a second substrate including a second metal layer;
- bonding the first substrate and the second substrate to each other with a bonding part that includes a eutectic layer, the eutectic layer having a eutectic alloy of a first metal of the first metal layer and a second metal of the second metal layer as a main component;
- and
- electrically connecting the bonding part to a ground reference potential of the resonance device.
A resonance device comprising:
- a first substrate that includes a resonator having a lower electrode and a wiring line layer electrically connected to the lower electrode;
- a second substrate;
- a bonding part that is electrically conductive and bonds the first substrate and the second substrate to each other;
- an anti-diffusion layer electrically connecting the wiring line layer and the bonding part to each other,
- wherein the bonding part includes a eutectic layer having a eutectic alloy as a main component,
- wherein the eutectic alloy consists of a first metal having aluminum as a main component and a second metal that is germanium,
- wherein a material of the anti-diffusion layer is molybdenum or tungsten,
- wherein a material of the lower electrode is degenerate silicon, and
- wherein a material of the wiring line layer is a metal having aluminum as a main component.
Dependencies are inferred from the claim text.