B81C 2203/035
Soldering
B81C2203/035 (Soldering) appears on 273 US grants and 339 published applications in this corpus.
Search patents in B81C- Granted patents
- 273
- Published applications
- 339
- Assignees
- 124
- Inventors
- 591
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 4 |
| 2003 | 4 | 2 |
| 2004 | 1 | 3 |
| 2005 | 1 | 2 |
| 2006 | 4 | 5 |
| 2007 | 0 | 2 |
| 2008 | 1 | 3 |
| 2009 | 0 | 3 |
| 2010 | 1 | 3 |
| 2011 | 5 | 11 |
| 2012 | 6 | 14 |
| 2013 | 5 | 10 |
| 2014 | 12 | 18 |
| 2015 | 12 | 16 |
| 2016 | 18 | 23 |
| 2017 | 30 | 29 |
| 2018 | 19 | 28 |
| 2019 | 26 | 37 |
| 2020 | 28 | 32 |
| 2021 | 26 | 15 |
| 2022 | 21 | 15 |
| 2023 | 14 | 23 |
| 2024 | 14 | 15 |
| 2025 | 15 | 15 |
| 2026 | 9 | 11 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Resonance device with anti-diffusion layer and resonance device manufacturing method25 Aug 2026US 12,719,443 B2Murata Manufacturing Co., Ltd.
- Stacked die package and methods of forming the same23 Jun 2026US 12,667,009 B2Qorvo US, Inc.
- Methods of manufacturing plasma generating cells for a plasma source14 Apr 2026US 12,601,621 B2APPLIED Materials.Inc.
- Die stacking with controlled tilt and angular alignment31 Mar 2026US 12,589,990 B2STMicroelectronics International N. V.
- Method for manufacturing an integrated system including a capacitive pressure sensor and an inertial sensor, and integrated system17 Feb 2026US 12,552,665 B2STMicroelectronics S,r.l.
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
- Asic capped double layer mems platform20 Aug 2026US 2026/0242213 A1Murata Manufacturing Co., Ltd.
- Methods of manufacturing plasma generating cells for a plasma source16 Jul 2026US 2026/0202227 A1APPLIED Materials.Inc.
- Method for eutectic sealing of two substrates16 Jul 2026US 2026/0206640 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Anti-Stiction Process for Mems Device14 May 2026US 2026/0132019 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Bonded structures181US 10,002,844 B1Invensas Bonding Technologies, Inc. · 2018
- Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates178US 6,815,739 B2Corporation for National Research Initiatives · 2004
- Method of fabrication of a AL/GE bonding in a wafer packaging environment and a product produced therefrom155US 7,442,570 B2Invensence Inc. · 2008
- Seal for microelectronic assembly142US 10,508,030 B2Invensas Bonding Technologies, Inc. · 2019