B81C 2203/032
Gluing
B81C2203/032 (Gluing) appears on 193 US grants and 246 published applications in this corpus.
Search patents in B81C- Granted patents
- 193
- Published applications
- 246
- Assignees
- 151
- Inventors
- 591
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 1 |
| 2002 | 0 | 3 |
| 2003 | 2 | 2 |
| 2004 | 5 | 1 |
| 2005 | 2 | 7 |
| 2006 | 3 | 5 |
| 2007 | 1 | 7 |
| 2008 | 2 | 10 |
| 2009 | 5 | 12 |
| 2010 | 10 | 12 |
| 2011 | 6 | 9 |
| 2012 | 11 | 13 |
| 2013 | 5 | 8 |
| 2014 | 10 | 4 |
| 2015 | 5 | 8 |
| 2016 | 3 | 5 |
| 2017 | 2 | 5 |
| 2018 | 8 | 25 |
| 2019 | 14 | 21 |
| 2020 | 14 | 15 |
| 2021 | 21 | 21 |
| 2022 | 16 | 12 |
| 2023 | 13 | 13 |
| 2024 | 11 | 10 |
| 2025 | 10 | 10 |
| 2026 | 9 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Integrated dicing die bonding sheet and method for producing semiconductor device25 Aug 2026US 12,721,105 B2Dow Toray Co., Ltd.
- Atomic-smooth device with microstructure, and method for preparing same7 Jul 2026US 12,673,866 B2
- Stacked die package and methods of forming the same23 Jun 2026US 12,667,009 B2Qorvo US, Inc.
- Die stacking with controlled tilt and angular alignment31 Mar 2026US 12,589,990 B2STMicroelectronics International N. V.
- Micro-electro mechanical system and manufacturing method thereof24 Feb 2026US 12,559,362 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
- Asic capped mems device20 Aug 2026US 2026/0242209 A1Murata Manufacturing Co., Ltd.
- Asic capped double layer mems platform20 Aug 2026US 2026/0242213 A1Murata Manufacturing Co., Ltd.
- Mems device, optical gas sensor device, manufacturing method for mems device, and manufacturing method for optical gas sensor device20 Aug 2026US 2026/0243667 A1Mitsumi Electric Co., Ltd.
- Method for bonding a mems to a substrate25 Jun 2026US 2026/0176131 A1Exail
Most cited
By later US patents
- Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby157US 6,777,767 B2Shellcase Ltd. · 2004
- Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances85US 6,791,660 B1Seiko Epson Corporation · 2004
- Air-release features in cavity packages65US 8,853,839 B2Analog Devices, Inc. · 2014
- Imprint lithographic method for making a polymeric structure59US 7,704,432 B2Agency for Science, Technology and Research · 2010
- Micro actuator56US 5,489,812 AInternational Business Machines Corporation · 1996