Air-release features in cavity packages
AssigneeAnalog Devices, Inc.
InventorsJia Gao, Jicheng Yang, Shafi Saiyed, Siu Lung Ng, Xiaojie Xue
Life of this patent
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Abstract
A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.
Claims53
A device package comprising:
- a package housing defining a cavity;
- a motion sensor die mounted within the housing;
- and
- a hole extending through the housing, wherein the housing has a bottom surface comprising at least one electrical lead configured to convey electrical signals between the device package and a external board, the hole extending through the bottom surface.
A method of integrating a motion sensor device package with an outside electronic circuit, the method comprising:
- providing a package substrate with a vent hole therethrough, the package substrate having bottom surface comprising at least one electrical lead configured to convey electrical signals between the device package and an external board, the vent hole extending through the bottom surface;
- mounting a motion sensor die on the package substrate;
- and
- attaching a lid to the package substrate to form a housing enclosing the motion sensor die in a cavity but for the vent hole.
Dependencies are inferred from the claim text.