Mems device, optical gas sensor device, manufacturing method for mems device, and manufacturing method for optical gas sensor device
AssigneeMitsumi Electric Co., Ltd.
InventorAkira TAKAHASHI
Life of this patent
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Abstract
A MEMS device includes: a MEMS element that has a space surrounded by an outer peripheral frame from four directions, has a thin film closing the space from an upper surface of the outer peripheral frame, and has an electrode pad for wire bonding on the outer peripheral frame; a mount on which the MEMS element is mounted; and a plurality of adhesive areas that bonds the MEMS element to the mount and are arranged on a plane of the mount. At least one of the plurality of adhesive areas is arranged at a position corresponding to the electrode pad in the plane.
Claims18
A MEMS device, comprising:
- a MEMS element that has a space surrounded by an outer peripheral frame from four directions, has a thin film closing the space from an upper surface of the outer peripheral frame, and has an electrode pad for wire bonding on the outer peripheral frame;
- a mount on which the MEMS element is mounted;
- and
- a plurality of adhesive areas that bonds the MEMS element to the mount and are arranged on a plane of the mount, wherein
- at least one of the plurality of adhesive areas is arranged at a position corresponding to the electrode pad in the plane.
A manufacturing method for a MEMS device, the method comprising:
- arranging at least one of a plurality of adhesive areas at a position corresponding to an electrode pad for wire bonding in a plane of a mount on which a MEMS element is mounted which has a space surrounded by an outer peripheral frame from four directions, has a thin film closing the space from an upper surface of the outer peripheral frame, and has the electrode pad on the outer peripheral frame;
- and
- mounting to bond and mount the MEMS element on the plurality of adhesive areas.
Dependencies are inferred from the claim text.