Method of fabricating micro-electromechanical system device
AssigneeVanguard International Semiconductor Corporation
InventorJia Jie Xia
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Abstract
The present disclosure related to a micro-electromechanical system (MEMS) device and a method of forming the same. The MEMS device includes a substrate, a cavity, an interconnection structure and a proof mass. The substrate includes a first surface and a second surface opposite to the first surface. The cavity is disposed in the substrate to extend between the first surface and the second surface. The interconnection structure is disposed on the first surface of the substrate, over the cavity. The proof mass is disposed on the interconnection structure, wherein the proof mass is partially suspended over the interconnection structure.
Claims7
A method of fabricating micro-electromechanical system device comprising:
- providing a substrate, the substrate comprising a first surface and a second surface opposite to the first surface;
- forming a cavity in the substrate, the cavity extending between the first surface and the second surface;
- forming an interconnection structure on the first surface of the substrate, over the cavity, wherein the interconnection structure comprises a suspended region corresponding to the cavity;
- forming a penetrating hole in the suspended region, wherein a free end of the interconnection structure is contiguous to the penetrating hole;
- forming a proof mass on the interconnection structure in the suspended region, wherein the proof mass is partially suspended over the interconnection structure for adjusting a resonant frequency of the interconnection structure in the suspended region;
- forming a base material layer on the interconnection structure before forming the cavity;
- forming a mass layer on the base material layer before forming the cavity;
- and
- partially removing the base material layer to form a base layer after forming the cavity.
Dependencies are inferred from the claim text.