B81C 2203/07
Integrating an electronic processing unit with a micromechanical structure
B81C2203/07 (Integrating an electronic processing unit with a micromechanical structure) appears on 1,051 US grants and 1,141 published applications in this corpus.
Search patents in B81C- Granted patents
- 1,051
- Published applications
- 1,141
- Assignees
- 321
- Inventors
- 1,640
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 4 | 0 |
| 1997 | 6 | 0 |
| 1998 | 14 | 0 |
| 1999 | 5 | 0 |
| 2000 | 12 | 0 |
| 2001 | 8 | 2 |
| 2002 | 10 | 5 |
| 2003 | 12 | 11 |
| 2004 | 13 | 20 |
| 2005 | 9 | 10 |
| 2006 | 7 | 16 |
| 2007 | 15 | 17 |
| 2008 | 8 | 21 |
| 2009 | 7 | 32 |
| 2010 | 25 | 30 |
| 2011 | 29 | 59 |
| 2012 | 43 | 40 |
| 2013 | 46 | 53 |
| 2014 | 50 | 72 |
| 2015 | 54 | 88 |
| 2016 | 99 | 100 |
| 2017 | 96 | 110 |
| 2018 | 79 | 87 |
| 2019 | 88 | 67 |
| 2020 | 80 | 74 |
| 2021 | 47 | 43 |
| 2022 | 48 | 48 |
| 2023 | 44 | 41 |
| 2024 | 28 | 36 |
| 2025 | 39 | 35 |
| 2026 | 19 | 24 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- MEMS pressure sensor built using the beol metal layers of a solid-state semiconductor process11 Aug 2026US 12,703,621 B2Nanusens SL
- MEMS pressure sensor11 Aug 2026US 12,704,427 B2MEI Micro, Inc.
- MEMS loudspeaker manufacturing method and MEMS loudspeaker21 Jul 2026US 12,686,614 B2Aac Kaitai Technologies (Wuhan) Co., Ltd
- Decoupling method for semiconductor device23 Jun 2026US 12,662,371 B2STMicroelectronics International N. V.
- Stacked die package and methods of forming the same23 Jun 2026US 12,667,009 B2Qorvo US, Inc.
- Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device8 Oct 2026US 2026/0307982 A1Hefei Smat Technology Co., Ltd.
- Deformation Bonded and Hermetically Sealed Vacuum MEMS Cells with Stopping Layer17 Sep 2026US 2026/0274653 A1HRL Laboratories, LLC
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Foundry-compatible process for integrated micro-speaker and microphone17 Sep 2026US 2026/0281642 A1Vibrant Microsystems Inc.
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
Most cited
By later US patents
- Vertical system integration289US 7,402,897 B2Elm Technology Corporation · 2008
- Lithography device for semiconductor circuit pattern generator287US 7,242,012 B2Elm Technology Corporation · 2007
- MEMS and CMOS integration with low-temperature bonding243US 9,394,161 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Polycrystalline silicon germanium films for forming micro-electromechanical systems226US 6,210,988 B1The Regents of the University of California · 2001
- Method for integrating microelectromechanical devices with electronic circuitry200US 5,963,788 ASandia Corporation · 1999