B81C 2203/05
Aligning components to be assembled
B81C2203/05 (Aligning components to be assembled) appears on 161 US grants and 184 published applications in this corpus.
Search patents in B81C- Granted patents
- 161
- Published applications
- 184
- Assignees
- 127
- Inventors
- 406
- Latest grant
- 14 Jul 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 7 |
| 2003 | 7 | 4 |
| 2004 | 3 | 4 |
| 2005 | 4 | 6 |
| 2006 | 3 | 12 |
| 2007 | 3 | 5 |
| 2008 | 9 | 13 |
| 2009 | 6 | 9 |
| 2010 | 15 | 11 |
| 2011 | 6 | 6 |
| 2012 | 3 | 9 |
| 2013 | 6 | 8 |
| 2014 | 3 | 7 |
| 2015 | 13 | 9 |
| 2016 | 12 | 3 |
| 2017 | 6 | 9 |
| 2018 | 7 | 6 |
| 2019 | 7 | 10 |
| 2020 | 8 | 7 |
| 2021 | 7 | 7 |
| 2022 | 5 | 6 |
| 2023 | 5 | 7 |
| 2024 | 3 | 7 |
| 2025 | 5 | 6 |
| 2026 | 9 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Systems and methods for fabricating a 2D-material-based quantum sensor chip14 Jul 2026US 12,685,199 B2Toyota Jidosha Kabushiki Kaisha
- Wafer level proximity sensor and method of making same16 Jun 2026US 12,655,017 B2STMicroelectronics International N. V.
- Package structure, apparatus and forming methods thereof26 May 2026US 12,641,370 B2xMEMS Labs, Inc.
- Die stacking with controlled angular alignment28 Apr 2026US 12,612,306 B2STMicroelectronics International N. V.
- Methods of manufacturing plasma generating cells for a plasma source14 Apr 2026US 12,601,621 B2APPLIED Materials.Inc.
- Wafer level proximity sensor and method of making same1 Oct 2026US 2026/0296880 A1STMicroelectronics International N. V.
- Bonding pillar structure for hidden comb microelectromechanical system17 Sep 2026US 2026/0280449 A1Lumentum Operations LLC
- Methods of manufacturing plasma generating cells for a plasma source16 Jul 2026US 2026/0202227 A1APPLIED Materials.Inc.
- Lensless near-contact imaging system for micro assembly12 Mar 2026US 2026/0075327 A1Genesee Valley Innovations, LLC
- Forming methods of package structure and apparatus12 Mar 2026US 2026/0075366 A1xMEMS Labs, Inc.
Most cited
By later US patents
- Heterogeneously integrated microsystem-on-a-chip337US 7,335,972 B2Sandia Corporation · 2008
- Methods of making, positioning and orienting nanostructures, nanostructure arrays and nanostructure devices234US 6,962,823 B2Nanosys, Inc. · 2005
- Methods of positioning and/or orienting nanostructures233US 6,872,645 B2Nanosys, Inc. · 2005
- Method and apparatus for the assembly of microfabricated devices153US 5,355,577 A1994
- Microfluidic structure assembly with mating microfeatures113US 5,932,315 AHewlett-Packard Company · 1999