Forming methods of package structure and apparatus

A forming method of a package structure, comprising:

• performing a manufacturing method to manufacture a cell, the manufacturing method comprising:
• providing a wafer comprising a first layer and a second layer;
• and
• patterning the first layer of the wafer, so as to form at least one trench line;
• and
• disposing the cell within a cover;
• wherein the first layer comprises a membrane anchored by an anchor structure of the cell, and at least one slit is formed within and penetrates through the membrane because of the at least one trench line;
• wherein the membrane comprises a first membrane subpart and a second membrane subpart, and the first membrane subpart and the second membrane subpart are opposite to each other in a top view viewing along a top-view direction, such that the first membrane subpart and the second membrane subpart are opposite to each other in a first direction perpendicular to the top-view direction;
• wherein the first membrane subpart comprises a first anchored edge which is fully or partially connected to the anchor structure for being fully or partially anchored by the anchor structure, and edges of the first membrane subpart other than the first anchored edge are non-anchored;
• wherein the second membrane subpart comprises a second anchored edge which is fully or partially connected to the anchor structure for being fully or partially anchored by the anchor structure, and edges of the second membrane subpart other than the second anchored edge are non-anchored.