B81C 2203/058
Aligning components using methods not provided for in b81c2203/051 - b81c2203/052
Official title: Aligning components using methods not provided for in B81C2203/051 - B81C2203/052
B81C2203/058 (Aligning components using methods not provided for in b81c2203/051 - b81c2203/052) appears on 25 US grants and 22 published applications in this corpus.
Search patents in B81C- Granted patents
- 25
- Published applications
- 22
- Assignees
- 23
- Inventors
- 67
- Latest grant
- 21 Jan 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1994 | 1 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 4 |
| 2003 | 4 | 0 |
| 2004 | 2 | 1 |
| 2005 | 0 | 1 |
| 2006 | 0 | 3 |
| 2007 | 2 | 3 |
| 2008 | 2 | 3 |
| 2009 | 2 | 1 |
| 2010 | 2 | 0 |
| 2011 | 2 | 2 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 1 |
| 2015 | 2 | 0 |
| 2016 | 1 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 0 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method for bonding wafers, and a wafer21 Jan 2025US 12,202,725 B2Murata Manufacturing Co., Ltd.
- Fully wafer-level-packaged MEMS microphone and method for manufacturing the same28 May 2019US 10,306,372 B2Goertek Inc.
- Three dimensional assembly of diamagnetic materials using magnetic levitation9 Aug 2016US 9,409,265 B2President and Fellows of Harvard College
- Active fixturing for micro/mesoscale, machine tool systems29 Dec 2015US 9,221,678 B2University of Florida Research Foundation, Inc.
- Method for manufacturing a hermetically sealed structure9 Jun 2015US 9,051,172 B2SensoNor AS
- Method for bonding wafers, and a wafer15 Sep 2022US 2022/0289567 A1Murata Manufacturing Co., Ltd.
- Fully wafer-level-packaged mems microphone and method for manufacturing the same8 Jun 2017US 2017/0164117 A1Goertek Inc.
- Three dimensional assembly of diamagnetic materials using magnetic levitation8 May 2014US 2014/0123461 A1President and Fellows of Harvard College
- Method for manufacturing a hermetically sealed structure13 Jun 2013US 2013/0146994 A1SensoNor AS
- Active fixturing for micro/mesoscale, machine tool systems,11 Aug 2011US 2011/0193281 A1University of Florida Research Foundation, Inc.
Most cited
By later US patents
- Heterogeneously integrated microsystem-on-a-chip337US 7,335,972 B2Sandia Corporation · 2008
- Method and apparatus for the assembly of microfabricated devices153US 5,355,577 A1994
- Spring structure with self-aligned release material60US 6,290,510 B1Xerox Corporation · 2001
- Oriented self-location of microstructures with alignment structures57US 7,223,635 B1HRL Laboratories, LLC · 2007
- Micromechanical die attachment surcharge56US 6,392,144 B1Sandia Corporation · 2002