Fully wafer-level-packaged mems microphone and method for manufacturing the same

A method for manufacturing a fully wafer-level-packaged MEMS microphone, comprising:

• separately manufacturing a first packaging wafer, an MEMS microphone wafer and a second packaging wafer, wherein the first packaging wafer comprises a plurality of first packaging units, the second packaging wafer comprises a plurality of second packaging units, and the MEMS microphone wafer comprises a plurality of MEMS microphone units, each of which comprises a silicon substrate formed with a back hole therein and an acoustic sensing part supported on the silicon substrate and aligned with the back hole, and wherein the first packaging units and/or the second packaging units and/or the MEMS microphone units comprise ASICs, and the first packaging units or the second packaging units also comprise acoustic ports for allowing an acoustic signal to reach the acoustic sensing parts;
• performing wafer-to-war bonding for the MEMS microphone wafer and the first packaging wafer and for the second packaging wafer and the MEMS microphone wafer, such that the first packaging units, the MEMS microphone units and the second packaging units are correspondingly aligned to form a plurality of fully wafer-level-packaged MEMS microphone units, in each of which electrical connections among the acoustic sensing part, the ASICs and surface mountable pads formed on the outer side of each of the first packaging unit and/or the outer side of each of the second packaging unit are realized by interconnection wires or conductive pads or through-silicon-vias or the combination thereof;
• singulating the fully wafer-level-packaged MEMS microphone units to form a plurality of fully wafer-level-packaged MEMS microphones.