Method for bonding wafers, and a wafer

A method for bonding a first wafer to a second wafer in a wafer bonding process, wherein each of the wafers extends planarly in two mutually orthogonal in-plane directions and comprises one or more bonding surface parts for forming a permanent contact between the wafers, wherein at least one of the wafers includes microstructures fabricated into the wafer, and the method comprises:

• forming at least one of the wafers to include at leas a first prebonding element and a second prebonding element, and each of the first and the second prebonding elements includes a first element point, a second element point, and an elastic element wherein the first element point is in a region through which the prebonding element is fixed to the first wafer, the elastic element extends from the first element point to the second element point and the elastic element is configured to deflect between the first element point and the second element point to enable movement of the second element point in an out-of-plane direction of the first wafer, wherein the out-of-plane direction is orthogonal to the two in-plane directions;
• wherein the elastic element in the first prebonding element extends in a first in-plane direction and the elastic element in the second prebonding element extends in a second in-plane direction, and the first in-plane direction is not parallel with the second in-plane direction;
• aligning the first wafer with the second wafer so that bonding surface parts of the first wafer are aligned with bonding surface parts of the second wafer;
• and
• implementing the wafer bonding process in which a permanent contact is formed between the bonding surface parts of the first wafer and the bonding surface parts of the second wafer.