B81C 2203/0109
Bonding an individual cap on the substrate
B81C2203/0109 (Bonding an individual cap on the substrate) appears on 466 US grants and 608 published applications in this corpus.
Search patents in B81C- Granted patents
- 466
- Published applications
- 608
- Assignees
- 205
- Inventors
- 1,006
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 15 |
| 2003 | 3 | 14 |
| 2004 | 15 | 21 |
| 2005 | 11 | 16 |
| 2006 | 18 | 19 |
| 2007 | 6 | 18 |
| 2008 | 9 | 12 |
| 2009 | 8 | 14 |
| 2010 | 17 | 19 |
| 2011 | 14 | 26 |
| 2012 | 14 | 18 |
| 2013 | 15 | 24 |
| 2014 | 23 | 22 |
| 2015 | 24 | 31 |
| 2016 | 31 | 46 |
| 2017 | 34 | 50 |
| 2018 | 42 | 34 |
| 2019 | 29 | 21 |
| 2020 | 30 | 34 |
| 2021 | 19 | 33 |
| 2022 | 20 | 22 |
| 2023 | 22 | 30 |
| 2024 | 20 | 23 |
| 2025 | 20 | 27 |
| 2026 | 14 | 19 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- MEMS device with an improved cap and related manufacturing process8 Sep 2026US 12,729,110 B2STMicroelectronics S,r.l.
- MEMS pressure sensor11 Aug 2026US 12,704,427 B2MEI Micro, Inc.
- Semiconductor structure and manufacturing method for the same4 Aug 2026US 12,698,201 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Process flow for thin contactless thermal sensors16 Jun 2026US 12,656,179 B2STMicroelectronics International N. V.
- Integrated device package with opening in carrier9 Jun 2026US 12,653,051 B2Skyworks Solutions, Inc.
- Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device8 Oct 2026US 2026/0307982 A1Hefei Smat Technology Co., Ltd.
- Electronic devices and methods of manufacturing electronic devices1 Oct 2026US 2026/0296878 A1Amkor Technology Singapore Holding Pte. Ltd.
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Asic capped mems device20 Aug 2026US 2026/0242209 A1Murata Manufacturing Co., Ltd.
- Microelectromechanical system20 Aug 2026US 2026/0242214 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Method for packaging microsensors228US 6,140,144 AIntegrated Sensing Systems, Inc. · 2000
- Lid wafer bond packaging and micromachining205US 5,915,168 AHarris Corporation · 1999
- Micro-electromechanical system device191US 6,384,353 B1Motorola, Inc. · 2002
- Seal for microelectronic assembly142US 10,508,030 B2Invensas Bonding Technologies, Inc. · 2019
- Bonded structures133US 11,004,757 B2Invensas Bonding Technologies, Inc. · 2021