B81C 2203/0154
Moulding a cap over the mems device
Official title: Moulding a cap over the MEMS device
B81C2203/0154 (Moulding a cap over the mems device) appears on 187 US grants and 213 published applications in this corpus.
Search patents in B81C- Granted patents
- 187
- Published applications
- 213
- Assignees
- 85
- Inventors
- 393
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 0 | 1 |
| 2002 | 4 | 0 |
| 2003 | 0 | 2 |
| 2004 | 2 | 0 |
| 2005 | 1 | 1 |
| 2006 | 0 | 2 |
| 2007 | 1 | 3 |
| 2008 | 1 | 4 |
| 2009 | 1 | 7 |
| 2010 | 3 | 10 |
| 2011 | 5 | 6 |
| 2012 | 10 | 9 |
| 2013 | 7 | 10 |
| 2014 | 14 | 9 |
| 2015 | 14 | 16 |
| 2016 | 11 | 15 |
| 2017 | 15 | 10 |
| 2018 | 9 | 13 |
| 2019 | 16 | 15 |
| 2020 | 20 | 18 |
| 2021 | 14 | 15 |
| 2022 | 11 | 17 |
| 2023 | 10 | 6 |
| 2024 | 9 | 7 |
| 2025 | 7 | 10 |
| 2026 | 2 | 7 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- MEMS device with an improved cap and related manufacturing process8 Sep 2026US 12,729,110 B2STMicroelectronics S,r.l.
- Process for manufacturing an optical microelectromechanical device having a tiltable structure with an antireflective surface3 Feb 2026US 12,540,070 B2STMicroelectronics S,r.l.
- O-ring seals for fluid sensing18 Nov 2025US 12,476,155 B2Texas Instruments Incorporated
- Semiconductor devices and related methods23 Sep 2025US 12,421,105 B2Amkor Technology Singapore Holding Pte.Ltd.
- Capless semiconductor package with a micro-electromechanical system (mems)23 Sep 2025US 12,421,108 B2STMicroelectronics S.r.l.
- Molded packages with attached connectors12 Mar 2026US 2026/0076219 A1NXP USA, Inc.
- O-ring seals for fluid sensing12 Mar 2026US 2026/0076253 A1
- Multi-chip sensor5 Mar 2026US 2026/0062286 A1Infineon Technologies AG
- Semiconductor package mold compound dams5 Mar 2026US 2026/0068746 A1
- Packaged mems device having a humidity sensor12 Feb 2026US 2026/0042662 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Pre-release plastic packaging of MEMS and IMEMS devices124US 6,379,988 B1Sandia Corporation · 2002
- Method of fabricating a molded package for micromechanical devices74US 6,489,178 B2Texas Instruments Incorporated · 2002
- In-situ cap and method of fabricating same for an integrated circuit device73US 6,465,280 B1Analog Devices, Inc. · 2002
- MEMS RF switch integrated process65US 7,381,583 B1The United States of America as represented by the Secretary of the Air Force · 2008
- Method for forming a flip chip pressure sensor die package59US 6,432,737 B1Amkor Technology, Inc. · 2002