Pre-release plastic packaging of MEMS and IMEMS devices

A method for activating at least one sensitive area of a microelectronic device, comprising:

• providing a microelectronic device having a sensitive area covered by a temporary protective material;
• wherein the temporary protective material is substantially encased in an electrically insulating material that is different than the temporary protective material;
• perforating the electrically insulating material to provide access to the temporary protective material;
• and
• removing the temporary protective material by using a non-ablative material removal process;
• whereby the sensitive area becomes activated by being exposed to the surrounding environment.

A method for activating at least one sensitive area of a microelectronic device, comprising, in the order presented:

• a) providing a microelectronic device comprising a sensitive area disposed on a substrate, wherein the sensitive area comprises an inner surface facing towards the substrate and an outer surface facing away from the substrate;
• and wherein the microelectronic device further comprises a layer of electrically insulating material disposed on and touching said outer surface of the sensitive area, wherein the outer surface of the sensitive area is covered and protected by the electrically insulating material;
• b) performing at least one packaging step;
• and
• c) perforating a sufficient amount of the layer of electrically insulating material to selectively expose at least part of the outer surface of the sensitive area to the surrounding environment by using a non-ablative material removal process to remove some, but not all, of the layer of electrically insulating material;
• whereby said at least part of the outer surface of the sensitive area becomes activated by exposing said at least part of the outer surface of the sensitive area to the surrounding environment.

A method for activating at least one sensitive area of a microelectronic device, comprising, in the order presented:

• a) providing a microelectronic device comprising a sensitive area disposed on a substrate, wherein the sensitive area comprises an inner surface facing towards the substrate and an outer surface facing away from the substrate;
• and wherein the microelectronic device further comprises a first layer comprising a temporary protective material disposed on and touching said outer surface of the sensitive area, wherein the outer surface of the sensitive area is covered and protected by the temporary protective material;
• and further wherein the temporary protective material is substantially encased in a second layer comprising an electrically insulating material that is different than the temporary protective material;
• b) perforating a sufficient amount of the second layer of electrically insulating material to provide access to the first layer of temporary protective material;
• and
• c) exposing at least part of the outer surface of the sensitive area to the surrounding environment by using a non-ablative material removal process to selectively remove at least some of the first layer of temporary protective material;
• whereby said at least part of the outer surface of the sensitive area becomes activated by exposing said at least part of the outer surface of the sensitive area to the surrounding environment.

A method for activating at least one sensitive area of a microelectronic device, comprising, in the order presented:

• a) providing a microelectronic device comprising a sensitive area disposed on a substrate, wherein the sensitive area comprises an inner surface facing towards the substrate and an outer surface facing away from the substrate;
• b) applying a temporary protective material on and touching said outer surface of the sensitive area;
• c) performing at least one packaging step;
• d) substantially encasing the temporary protective material in a second layer comprising an electrically insulating material that is different than the temporary protective material;
• e) perforating a sufficient amount of the second layer of electrically insulating material to provide access to the first layer of temporary protective material;
• and
• f) exposing at least part of the outer surface of the sensitive area to the surrounding environment by using a non-ablative material removal process to selectively remove at least some of the first layer of temporary protective material;
• whereby said at least part of the outer surface of the sensitive area becomes activated by exposing said at least part of the outer surface of the sensitive area to the surrounding environment.

A method of packaging a MEMS device, comprising, in the order presented:

• a) providing a wafer comprising a plurality of unreleased MEMS devices fabricated on the wafer;
• b) releasing the MEMS elements;
• c) applying a first layer comprising a temporary protective material to the released MEMS elements;
• d) singulating the wafer into a plurality of individual dies each comprising a MEMS device covered by the temporary protective material;
• e) attaching the die and wirebonding the MEMS device;
• f) substantially encasing at least the temporary protective material in a second layer comprising an electrically insulating material that is different than the temporary protective material;
• g) perforating a sufficient amount of the second layer of electrically insulating material to provide access to the first layer of temporary protective material, while not removing electrically insulating material from the wirebonds;
• and
• h) exposing and releasing the temporarily protected MEMS elements by using a non-ablative material removal process to selectively remove the temporary protective material;
• thereby activating the MEMS device.