O-ring seals for fluid sensing
AssigneeTexas Instruments Incorporated
InventorsSebastian Meier, Bernhard Peter Lange
Life of this patent
Estimating the term…
Abstract
In some examples, a device comprises a substrate including a notch formed in a surface of the substrate and a semiconductor die positioned in the notch and including an electrochemical sensor on an active surface of the semiconductor die. The device also comprises a chemically inert member abutting the surface of the substrate and including an orifice in vertical alignment with the electrochemical sensor as a result of the semiconductor die being positioned in the notch. The device also comprises a compressed o-ring seal positioned between the chemically inert member and the active surface of the semiconductor die, the compressed o-ring seal circumscribing the electrochemical sensor.
Claims14
A method, comprising:
- providing a substrate including a notch formed in a surface of the substrate;
- positioning a semiconductor die in the notch, the semiconductor die including an electrochemical sensor positioned on an active surface of the semiconductor die;
- coupling a bond wire to the substrate and to the active surface of the semiconductor die;
- providing a chemically inert member including an orifice formed therein and a second member extending through the orifice of the chemically inert member, an o-ring seal circumscribing the second member;
- coupling the chemically inert member to the substrate such that the o-ring seal circumscribing the second member is compressed between the chemically inert member and the semiconductor die and such that the o-ring seal circumscribes the electrochemical sensor, a position of the o-ring seal determined by the second member and as a result of positioning the semiconductor die in the notch;
- positioning a mold compound between the chemically inert member, the substrate, and the o-ring seal;
- and
- removing the second member after positioning the mold compound between the chemically inert member, the substrate, and the o-ring seal.
A method, comprising:
- providing a substrate including a first orifice;
- coupling an active surface of a semiconductor die to the substrate, the active surface facing the substrate and including an electrochemical sensor;
- aligning an o-ring seal with respect to the electrochemical sensor using a wall of the first orifice;
- based on the alignment, positioning an o-ring seal on the active surface via the first orifice of the substrate;
- compressing the o-ring seal using a chemically inert member;
- and
- positioning a mold compound inside a second orifice in the substrate and inside a third orifice in the chemically inert member, the second and third orifices in fluid communication with each other.
A method, comprising:
- providing a substrate including an orifice;
- coupling a device side of a semiconductor die to the substrate such that the device side is in physical contact with the substrate via a conductive terminal, the device side including an electrochemical sensor;
- and
- positioning an o-ring seal between the substrate and the device side such that the o-ring seal circumscribes the electrochemical sensor and such that the o-ring seal is compressed.
Dependencies are inferred from the claim text.