Capless semiconductor package with a micro-electromechanical system (mems)
AssigneeSTMicroelectronics S.r.l.
InventorJefferson Sismundo Talledo
Life of this patent
Estimating the term…
Abstract
A semiconductor package that contains an application-specific integrated circuit (ASIC) die and a micro-electromechanical system (MEMS) die. The MEMS die and the ASIC die are coupled to a substrate that includes an opening that extends through the substrate and is in fluid communication with an air cavity positioned between and separating the MEMS die from the substrate. The opening exposes the air cavity to an external environment and, following this, the air cavity exposes a MEMS element of the MEMS die to the external environment. The air cavity separating the MEMS die from the substrate is formed with a method of manufacturing that utilizes a thermally decomposable die attach material.
Claims20
A method, comprising:
- coupling a MEMS die to a surface of a substrate utilizing a sacrificial layer on a first surface of the MEMS die facing the surface of the substrate;
- forming a molding compound covering a plurality of first sidewalls of the MEMS die and a plurality of second sidewalls of the sacrificial layer;
- after the MEMS die has been coupled to the surface of the substrate with the sacrificial layer and after the molding compound has been formed, forming an opening that extends through the substrate to the sacrificial layer and exposes the sacrificial layer;
- and
- after forming the opening, removing the sacrificial layer, and the removing forming a space separating the first surface of the MEMS die from the substrate.
A method, comprising:
- coupling a first surface of a MEMS die at which a sensor component of the MEMS die is present to a second surface of a substrate with a sacrificial layer;
- forming at least one first wire electrically coupling a contact pad of the MEMS die at a third surface of the MEMS die opposite to the first surface of the MEMS die;
- forming a molding compound covering the MEMS die, the sacrificial layer, and the at least one first wire, and a plurality of sidewalls of the MEMS die that extend from the first surface of the MEMS die to the third surface of the MEMS die;
- after forming the molding compound, forming an opening extending through the substrate from a fourth surface of the substrate opposite to the second surface of the substrate to the second surface of the substrate;
- forming a space between the first surface of the MEMS die and the second surface of the substrate by removing the sacrificial layer exposing a plurality of walls of the molding compound delimiting the space.
A method, comprising:
- coupling a first surface of a MEMS die at which a sensor component of the MEMS die is present to a second surface of a substrate with a sacrificial layer;
- forming a molding compound covering the MEMS die and the sacrificial layer, and covering a plurality of sidewalls of the MEMS die that are transverse to the first surface of the MEMS die and extend from the first surface of the MEMS die;
- after forming the molding compound, forming an opening extending through the substrate from a fourth surface of the substrate opposite to the second surface of the substrate to the second surface of the substrate;
- forming a space between the first surface of the MEMS die and the second surface of the substrate by removing the sacrificial layer exposing a plurality of walls of the molding compound delimiting the space, and removing the sacrificial layer includes exposing the sacrificial layer to heat generated by a heat source.
Dependencies are inferred from the claim text.