US 6,432,737 B1 · Method for forming a flip chip pressure sensor die package

Abstract

A plurality of pressure sensor dice are attached to an array of pressure sensor die attach sites located on a custom substrate having holes. The pressure sensor dice are then electrically connected to the pressure sensor die attach sites using standard flip chip techniques. The resulting array of pressure sensor sub-assemblies is then molded, so that a cavity is formed that is open at the bottom of each hole in the custom substrate. A portion of the outer surface of the micro-machine element of each pressure sensor die is left exposed at the bottom of the hole in the substrate. After molding, the exposed outer surface of the micro-machine element is covered with a pressure coupling gel applied in the hole. The resulting array of packaged pressure sensors are then sigulated using well know sawing or laser techniques or by snapping a specially formed snap array.

Claims26

Dependent claims

A method for making a pressure sensor die package comprising:

providing a pressure sensor die, said pressure sensor die comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;
providing a substrate, said substrate comprising a substrate first surface and a substrate second surface, opposite said substrate first surface, said substrate first surface comprising a die attach region, said substrate further comprising a hole connecting said substrate first surface and said substrate second surface, said hole being located in said die attach region of said substrate first surface;
attaching said pressure sensor die first surface to said substrate first surface in said die attach region such that a first region of said pressure sensor die first surface covers said hole in said die attach region;
and
applying encapsulant to at least a portion of said substrate first surface and said pressure sensor die second surface, said encapsulant comprising an outer surface.

2 more elements

A method for making pressure sensor die packages comprising:

providing a plurality of pressure sensor dice, said pressure sensor dice each comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface;
forming an array substrate, said array substrate comprising an array substrate first surface and an array substrate second surface, opposite said array substrate first surface, said array substrate first surface comprising a plurality of die attach regions, said array substrate comprising a plurality of holes connecting said array substrate first surface and said array substrate second surface, wherein;
each die attach region of said plurality of die attach regions has a corresponding one of said plurality of holes therein;
attaching each of said pressure sensor die first surfaces to said array substrate first surface in a corresponding one of said die attach regions such that a first region of each of said pressure sensor die first surfaces covers said corresponding hole in each of said die attach regions;
and
applying encapsulant to at least a portion of said array substrate first surface and said pressure sensor die second surfaces, said encapsulant comprising an outer surface.

3 more elements

A method for making pressure sensor die packages comprising:

providing a plurality of pressure sensor dice, said pressure sensor dice each comprising a pressure sensor die first surface and a pressure sensor die second surface, opposite said pressure sensor die first surface, each of said plurality of pressure sensor dice comprising a differential pressure sensor die, said plurality of pressure sensor dice each comprising a die hole connecting said second surface of each of said pressure sensor dice to a cavity formed in each of said pressure sensor dice;
forming an array substrate, said array substrate comprising an array substrate first surface and an array substrate second surface, opposite said array substrate first surface, said array substrate first surface comprising a plurality of die attach regions, said array substrate comprising a plurality of holes connecting said array substrate first surface and said array substrate second surface, wherein;
each die attach region of said plurality of die attach regions has a corresponding one of said plurality of holes therein;
attaching each of said pressure sensor die first surfaces to said array substrate first surface in a corresponding one of said die attach regions such that a first region of each of said pressure sensor die first surfaces covers said corresponding hole in each of said die attach regions;
applying encapsulant to at least a portion of said array substrate first surface and said pressure sensor die second surfaces, said encapsulant comprising an outer surface;
filling at least a portion of each of said plurality of holes in said array substrate with coupling gel such that each of said first regions of said first surfaces of said plurality of pressure sensor dice is covered by said coupling gel;
forming a plurality of encapsulant through holes in said encapsulant, each encapsulant through hole of said plurality of encapsulant through holes extending from said encapsulant outer surface to a first region of said first surface of each of said plurality of pressure sensor dice;
and
at least partially aligning each of said die holes with one of said plurality of array substrate through holes.

6 more elements

Dependencies are inferred from the claim text.

Method for forming a flip chip pressure sensor die package

Life of this patent

Method for forming a flip chip pressure sensor die package

Life of this patent

Abstract

Claims26