B81C 2203/0136
Growing or depositing of a covering layer
B81C2203/0136 (Growing or depositing of a covering layer) appears on 328 US grants and 376 published applications in this corpus.
Search patents in B81C- Granted patents
- 328
- Published applications
- 376
- Assignees
- 118
- Inventors
- 518
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 5 | 0 |
| 1999 | 1 | 0 |
| 2000 | 3 | 0 |
| 2001 | 1 | 1 |
| 2002 | 5 | 1 |
| 2003 | 1 | 9 |
| 2004 | 7 | 18 |
| 2005 | 9 | 15 |
| 2006 | 13 | 11 |
| 2007 | 7 | 10 |
| 2008 | 5 | 19 |
| 2009 | 9 | 13 |
| 2010 | 21 | 16 |
| 2011 | 19 | 40 |
| 2012 | 12 | 11 |
| 2013 | 15 | 14 |
| 2014 | 23 | 23 |
| 2015 | 24 | 28 |
| 2016 | 25 | 31 |
| 2017 | 22 | 27 |
| 2018 | 23 | 25 |
| 2019 | 22 | 21 |
| 2020 | 15 | 15 |
| 2021 | 20 | 4 |
| 2022 | 5 | 5 |
| 2023 | 5 | 4 |
| 2024 | 1 | 4 |
| 2025 | 5 | 5 |
| 2026 | 3 | 6 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Through-substrate conductor support11 Aug 2026US 12,703,625 B2Texas Instruments Incorporated
- Atomic-smooth device with microstructure, and method for preparing same7 Jul 2026US 12,673,866 B2
- Laterally-doped MEMS resonator with piezoelectric layer17 Feb 2026US 12,556,157 B1SiTime Corporation
- Wafer level package21 Oct 2025US 12,451,861 B2RF360 Singapore Pte. Ltd.
- Barrier structure within a microelectronic enclosure23 Sep 2025US 12,421,104 B2Texas Instruments Incorporated
- Airtight structure, method for manufacturing same, and base resin composition for maintaining airtightness13 Aug 2026US 2026/0233988 A1Resonac Corporation
- Micromechanical pressure sensor with enclosed housing wall23 Jul 2026US 2026/0209031 A1
- Vertical mems probe having tethering structure and manufacturing method thereof2 Jul 2026US 2026/0186021 A1Withmems Co., Ltd.
- Polymer nanofiber environmental barrier structure30 Apr 2026US 2026/0116743 A1Infineon Technologies AG
- Wafer level package12 Feb 2026US 2026/0045929 A1RF360 Singapore Pte. Ltd.
Most cited
By later US patents
- Method for fabricating a structure for a microelectromechanical systems (MEMS) device722US 6,794,119 B2Iridigm Display Corporation · 2004
- Method for forming micro cavity560US 6,342,427 B12002
- Display device with micromechanical leaf spring switches250US 4,681,403 AU. S. Philips Corporation · 1987
- Wafer-level MEMS packaging205US 6,635,509 B1DALSA Semiconductor Inc. · 2003
- Manufacture of MEMS structures in sealed cavity using dry-release MEMS device encapsulation191US 7,008,812 B1IC Mechanics, Inc. · 2006