B81C 2203/0163
Reinforcing a cap
Official title: Reinforcing a cap, e.g. with ribs
B81C2203/0163 (Reinforcing a cap) appears on 33 US grants and 35 published applications in this corpus.
Search patents in B81C- Granted patents
- 33
- Published applications
- 35
- Assignees
- 29
- Inventors
- 90
- Latest grant
- 14 Jan 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 1 | 4 |
| 2007 | 0 | 1 |
| 2008 | 2 | 1 |
| 2009 | 1 | 3 |
| 2010 | 1 | 1 |
| 2011 | 2 | 2 |
| 2012 | 3 | 1 |
| 2013 | 3 | 1 |
| 2014 | 0 | 3 |
| 2015 | 6 | 3 |
| 2016 | 2 | 5 |
| 2017 | 1 | 4 |
| 2018 | 1 | 0 |
| 2019 | 1 | 0 |
| 2020 | 2 | 1 |
| 2021 | 2 | 0 |
| 2022 | 0 | 3 |
| 2023 | 0 | 0 |
| 2024 | 2 | 0 |
| 2025 | 1 | 1 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for producing a plurality of sensor devices, and sensor device14 Jan 2025US 12,195,330 B2Robert Bosch GmbH
- Hermetically sealed, toughened glass package and method for producing same28 May 2024US 11,993,511 B2Schott AG
- Hollow package and method for manufacturing same9 Apr 2024US 11,955,394 B2Nippon Kayaku Kabushiki Kaisha
- Covering for a component and method for producing a covering for a component23 Nov 2021US 11,180,364 B2SnapTrack, Inc.
- Electronic component and module including the same5 Oct 2021US 11,139,795 B2Murata Manufacturing Co., Ltd.
- Micromechanical component for a sensor device, microphone device and/or micro-loudspeaker device27 Aug 2026US 2026/0250121 A1
- Encapsulated mems devices4 Sep 2025US 2025/0276891 A1
- Hermetically sealed, toughened glass package and method for producing same5 May 2022US 2022/0135398 A1Schott AG
- Hollow Package And Method For Manufacturing Same3 Mar 2022US 2022/0068737 A1Nippon Kayaku Kabushiki Kaisha
- Method for producing a plurality of sensor devices, and sensor device10 Feb 2022US 2022/0041436 A1Robert Bosch GmbH
Most cited
By later US patents
- Metal mesh lid MEMS package and method21US 8,536,663 B1Amkor Technology, Inc. · 2013
- System and method for protecting microelectromechanical systems array using structurally reinforced back-plate19US 7,405,924 B2Idc, LLC · 2008
- Micromechanical cap structure and the respective manufacturing method18US 6,462,392 B1Robert Bosch GmbH · 2002
- System and method for protecting microelectromechanical systems array using back-plate with non-flat portion18US 7,368,803 B2Idc, LLC · 2008
- Structure and formation method of semiconductor device structure15US 9,834,435 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2017