Method for producing a plurality of sensor devices, and sensor device

A method for producing a plurality of sensor devices, comprising the following steps:

• furnishing a covering device that spans a holding frame;
• attaching or stamping a frame structure onto the covering device, or stamping out of the covering device the frame structure, the frame structure defining predetermined regions for sensor chips and surrounding the predetermined regions as respective cavities;
• furnishing a substrate having sensor chips disposed thereon, a disposition of the sensor chips on the substrate corresponding to the cavities of the frame structure;
• disposing the substrate on the frame structure in such a way that at least one sensor chip is encompassed by one of the cavities, the substrate being adhesively bonded to the frame structure;
• and
• singulating only the substrate around the respective cavities into the plurality of sensor devices,
• wherein the covering device spans at least one of the respective cavities for the sensor chips so as to cover the at least one of the cavities.

A sensor device, comprising:

• a substrate having contact points and at least one sensor chip contacted to the contact points;
• a frame structure on the substrate which forms a cavity for the sensor chip and extends from the substrate vertically beyond the sensor chip;
• and
• a covering device disposed on the frame structure and so as to at least partly span the cavity,
• wherein the frame structure is produced from an injection-molded part and the covering device encompasses a microporous membrane.