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US 11,180,364 B2Granted
Covering for a component and method for producing a covering for a component
AssigneeSnapTrack, Inc.
InventorAnsgar Schäufele
Life of this patent
Estimating the term…
Abstract
The invention relates to a covering (1) for an electronic component (e.g. of the MEMS, BAW, or SAW type). The covering comprises at least one layer (5, 6, 7) having a structure (19, 20, 21) with a number of prominences (8, 9, 15) and/or depressions (10, 11, 16). The invention furthermore relates to a method for producing a covering (1) of this type.
Claims13
An electronic component covering, comprising:
- a bottommost layer;
- at least one middle layer, having a structure comprising a number of prominences and a number of depressions;
- and
- a topmost layer completely filling at least some of the number of depressions, wherein:
- a bottom side of the bottommost layer and a top side of the topmost layer are free of the structure;
- the electronic component covering configured to hermetically enclose a hollow space such that one or more electrical component structures may be arranged in the hollow space;
- and
- the bottom side of the bottommost layer directly adjoins the hollow space.
5 more elements
An electronic component, comprising:
- an electronic component structure;
- and
- an electronic component covering that covers the electronic component structure, wherein the electronic component covering comprises:
- a bottommost layer;
- at least one middle layer, having a structure comprising a number of prominences and a number of depressions;
- and
- a topmost layer completely filling at least some of the number of depressions, wherein:
- a bottom side of the bottommost layer and a top side of the topmost layer are free of the structure;
- the electronic component covering delimits a hollow space;
- the bottom side of the bottommost layer directly adjoins the hollow space;
- one or more electrical component structures are arranged in the hollow space;
- and
- the one or more electrical components are hermetically encapsulated by
- the electronic component cover.
11 more elements
Dependencies are inferred from the claim text.