System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
AssigneeIdc, LLC
InventorsBrian Gally, Lauren Palmateer, William J. Cummings
Life of this patent
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Abstract
Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the display array with a gap between the back-plate and the display array. The device further includes reinforcing structures which are integrated with the back-plate. The reinforcing structures add stiffness to the back-plate. The back-plate may have a thickness varying along an edge thereof.
Claims30
An electronic device, comprising:
- a substrate;
- an array of microelectromechanical devices formed on the substrate, the array having a back-surface facing away from the substrate;
- a back-plate placed over the array and having an interior surface and an exterior surface, the interior surface facing the back-surface of the array with a gap therebetween, the exterior surface facing away from the substrate;
- and
- one or more reinforcing structures integrated with the back-plate, wherein the one or more reinforcing structures do not contact the substrate while the back-plate and substrate are sealed along peripheries thereof.
An electronic device, comprising:
- a substrate;
- an array of interferometric modulators formed on the substrate, the array having a back-surface facing away from the substrate;
- a back-plate placed over the array and having an interior surface facing the back-surface of the array with a gap between the interior surface and the back-surface of the array;
- and
- means for preventing the interior surface from directly contacting the back-surface of the array, wherein the preventing means does not contact the substrate while the back-plate and substrate are sealed alone peripheries thereof.
A method of making an electronic device, comprising:
- providing an intermediate device comprising a substrate and an array of microelectromechanical devices formed on the substrate, the array having a back-surface facing away from the substrate;
- and
- forming a back-plate over the array of the intermediate device, the back-plate having an interior surface and an exterior surface, the interior surface facing the back-surface of the array with a gap therebetween, the back-plate being integrated with one or more reinforcing structures formed on at least one of the interior surface and the exterior surface, wherein the one or more reinforcing structures do not contact or attached to the substrate while the back-plate and substrate are sealed along peripheries thereof.
An electronic device produced by a method comprising:
- providing an intermediate device comprising a substrate and an array of microelectromechanical devices formed on the substrate, the array having a back-surface facing away from the substrate;
- and
- forming a back-plate over the array of the intermediate device, the back-plate having an interior surface and an exterior surface, the interior surface facing the back-surface of the array with a gap therebetween, the back-plate being integrated with one or more reinforcing structures formed on at least one of the interior surface and the exterior surface, wherein the one or more reinforcing structures do not contact or attached to the substrate while the back-plate and substrate are sealed along peripheries thereof.
Dependencies are inferred from the claim text.