B81C 2203/0127
Using a carrier for applying a plurality of packaging lids to the
Official title: Using a carrier for applying a plurality of packaging lids to the system wafer
B81C2203/0127 (Using a carrier for applying a plurality of packaging lids to the) appears on 49 US grants and 59 published applications in this corpus.
Search patents in B81C- Granted patents
- 49
- Published applications
- 59
- Assignees
- 29
- Inventors
- 80
- Latest grant
- 24 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 3 |
| 2003 | 0 | 5 |
| 2004 | 4 | 10 |
| 2005 | 4 | 3 |
| 2006 | 6 | 0 |
| 2007 | 2 | 5 |
| 2008 | 3 | 1 |
| 2009 | 2 | 2 |
| 2010 | 2 | 1 |
| 2011 | 0 | 2 |
| 2012 | 1 | 1 |
| 2013 | 2 | 3 |
| 2014 | 1 | 3 |
| 2015 | 3 | 2 |
| 2016 | 3 | 2 |
| 2017 | 1 | 3 |
| 2018 | 4 | 3 |
| 2019 | 0 | 2 |
| 2020 | 4 | 2 |
| 2021 | 1 | 1 |
| 2022 | 0 | 1 |
| 2023 | 2 | 1 |
| 2024 | 0 | 1 |
| 2025 | 1 | 2 |
| 2026 | 1 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- High reliability sensor24 Feb 2026US 12,559,363 B2Texas Instruments Incorporated
- Method for producing a plurality of sensor devices, and sensor device14 Jan 2025US 12,195,330 B2Robert Bosch GmbH
- Eutectic bonding with AlGe15 Aug 2023US 11,724,933 B2Rohm Co., Ltd.
- Optical electronics device6 Jun 2023US 11,667,523 B2Texas Instruments Incorporated
- Optical electronics device19 Jan 2021US 10,894,712 B2Texas Instruments Incorporated
- Micro-electro-mechanical system package and fabrication method thereof8 May 2025US 2025/0145452 A1Vanguard International Semiconductor Corporation
- High reliability sensor6 Mar 2025US 2025/0074765 A1Texas Instruments Incorporated
- Mems device having an improved cap and manufacturing process thereof18 Jul 2024US 2024/0239648 A1STMicroelectronics S,r.l.
- Packaging structures and packaging methods for ultrasound-on-chip devices2 Feb 2023US 2023/0034707 A1Bfly Operations, Inc.
- Method for producing a plurality of sensor devices, and sensor device10 Feb 2022US 2022/0041436 A1Robert Bosch GmbH
Most cited
By later US patents
- Lid wafer bond packaging and micromachining205US 5,915,168 AHarris Corporation · 1999
- Lid wafer bond packaging and micromachining115US 5,798,557 AHarris Corporation · 1998
- Chip with molded cap array95US 6,979,599 B2Silverbrook Research Pty Ltd · 2005
- Packaged accelerometer22US 6,925,875 B2Silverbrook Research Pty Ltd · 2005
- Method for manufacturing capped MEMS components9US 8,470,631 B2Robert Bosch GmbH · 2013