DALSA Semiconductor Inc.
Waterloo, ON, CA· latest recorded location
DALSA Semiconductor Inc. is named on 35 US grants and 34 published applications in this corpus. Its most frequent classification is B81C (Processes or apparatus specially adapted for the manufacture or treatment of microstructural).
- Granted patents
- 35
- Published applications
- 34
- Inventors
- 36
- Granted in 2026 so far
- 0
- Most recent grant
- 19 Apr 2011
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 0 | 8 |
| 2003 | 7 | 8 |
| 2004 | 6 | 2 |
| 2005 | 5 | 4 |
| 2006 | 4 | 3 |
| 2007 | 2 | 5 |
| 2008 | 4 | 1 |
| 2009 | 2 | 2 |
| 2010 | 4 | 1 |
| 2011 | 1 | 0 |
By publication year.
Technology areas
Share of 69 documents
- B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural33
- C23CCoating metallic material18
- G02BOptical elements, systems or apparatus14
- B81BMicrostructural devices or systems13
- H10PGeneric processes or apparatus for the manufacture or treatment of devices covered13
- H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by9
- G03FPhotomechanical production of textured or patterned surfaces7
- H10DInorganic electric semiconductor devices6
- Y10TTechnical subjects covered by former us classification5
- Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4
Recent patents
- Method of making BIOMEMS devices19 Apr 2011US 7,927,904 B2
- Method of making MEMS wafers5 Oct 2010US 7,807,550 B2
- Method of controlling film stress in MEMS devices21 Sep 2010US 7,799,376 B2
- Microchannels for BioMEMS devices21 Sep 2010US 7,799,656 B2
- Protection capsule for MEMS devices23 Mar 2010US 7,682,860 B2
- Method of making biomems devices8 Jul 2010US 2010/0173436 A1
- Deep reactive ion etching1 Oct 2009US 2009/0242512 A1
- Method of controlling film stress in mems devices29 Jan 2009US 2009/0029533 A1
- Microchannels for biomems devices4 Dec 2008US 2008/0299695 A1
- Protection capsule for mems devices4 Oct 2007US 2007/0231943 A1
Most cited
By later US patents
- Wafer-level MEMS packaging205US 6,635,509 B12003
- Anhydrous HF release of process for MEMS devices201US 7,365,016 B22008
- Manufacture of integrated fluidic devices76US 6,602,791 B22003
- Wafer level packaging technique for microdevices30US 7,138,293 B22006
- Fabrication of microstructures with vacuum-sealed cavity29US 6,902,656 B22005