Protection capsule for MEMS devices

A method of making a MEMS device, comprising:

• depositing a silicon nitride layer onto a silicon carrier wafer;
• exposing the silicon nitride layer to anhydrous hydrofluoric acid to transform a surface sublayer of silicon nitride layer into ammonium fluorosilicate;
• forming multiple protective capsules on said ammonium fluorosilicate sublayer;
• bringing said silicon carrier wafer into contact with a MEMS wafer such that said mutiple protective components are aligned with respective mechanical components formed on the MEMS wafer;
• applying pressure to said carrier wafer and said MEMS wafer to bond said protective components to said MEMS wafer;
• and
• subsequently heating the bonded wafers to a temperature sufficient to decompose the ammonium silicate and thereby release the carrier wafer from the protective components, whereby the ammonium silicate sublayer is used as a temporary adhesion layer to permit the transfer of protective components from the carrier wafer to the MEMS wafer.