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US 7,799,656 B2Granted
Microchannels for BioMEMS devices
AssigneeDALSA Semiconductor Inc.
InventorsLuc Ouellet, Patrick Wright
Life of this patent
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Abstract
A method is disclosed for making a MEMS device wherein anhydrous HF exposed silicon nitride is used as a temporary adhesion layer allowing the transfer of a layer from a Carrier Wafer to a Device Wafer.
Claims16
A method of making a MEMS device, comprising:
- depositing a silicon nitride layer on a carrier wafer;
- chemically modifying said silicon nitride layer by exposure to anhydrous hydrofluoric acid to form a modified surface layer subject to thermal decomposition into gaseous by-products;
- forming a patterned first photopolymer layer on said modified surface layer;
- forming a patterned second photopolymer layer on a device wafer;
- bonding the patterned first and second photopolymer layers of the carrier wafer and the device wafer together to form an integrated device by applying heat and pressure;
- and
- applying heat to decompose said modified surface layer and thereby separate the carrier wafer from the device wafer.
4 more elements
A method of forming a MEMS device containing microchannels, comprising:
- depositing a silicon nitride layer on a carrier wafer;
- modifying a surface portion of said silicon nitride layer by exposure to anhydrous hydrofluoric acid to form a modified surface layer;
- forming a patterned first photopolymer layer on said modified surface layer;
- forming a patterned second photopolymer layer on a device wafer;
- bonding said patterned first and second photopolymer layers together to form an integrated device containing the microchannels;
- and
- releasing said carrier wafer by heating said structures to decompose said modified surface layer.
4 more elements
Dependencies are inferred from the claim text.