Micro-electro-mechanical system package and fabrication method thereof

A method of fabricating a micro-electro-mechanical system (MEMS) package, comprising:

• providing a cap wafer with a first cavity and a second cavity formed therein;
• providing a device wafer;
• bonding the device wafer to the cap wafer;
• patterning the device wafer to form a first MEMS device and a second MEMS device laterally spaced apart from each other, wherein the first MEMS device corresponds to the first cavity, and the second MEMS device corresponds to the second cavity;
• providing a wafer with an interconnect structure formed thereon;
• forming a getter on the interconnect structure;
• bonding the device wafer to the interconnect structure on the wafer at a first pressure, wherein both the first cavity and the second cavity have the first pressure, and the getter is located directly under the second MEMS device;
• and
• activating the getter to reduce the first pressure in the second cavity to a second pressure, wherein the first cavity has the first pressure, and the second cavity has the second pressure lower than the first pressure.