Chip with molded cap array
AssigneeSilverbrook Research Pty Ltd
InventorKia Silverbrook
Life of this patent
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Abstract
A chip is made by a method. The method provides an array of caps for protecting features on a semiconductor wafer. The array is fabricated by a novel method in which a two part mold is used. The array is made from a layer of thermoplastic material which is placed in the mold. Each cap in the array has a central portion and a perimeter wall. The mold is opened so that the array is carried by the first half. The array is applied to a wafer using the first half. After the arrays are applied, the wafer is separated into individual chips.
Claims18
An individual chip with one or more protective polymeric wafer scale caps, made by a method, the method including:
- a) forming, in a two part mold, an array of first hollow molded caps, from a layer of thermoplastic material which is placed in a mold, the mold having first and second mold halves which are brought together to form the caps, each cap having a central portion and a perimeter wall;
- b) opening the mold so that the caps are carried by the first half;
- c) applying, using the first half, the first caps to one side of a wafer;
- then
- d) separating the wafer into individual chips;
- wherein the mold and the wafer are made from the same material.
Dependencies are inferred from the claim text.