B81C 2203/0145
Hermetically sealing an opening in the lid
B81C2203/0145 (Hermetically sealing an opening in the lid) appears on 349 US grants and 439 published applications in this corpus.
Search patents in B81C- Granted patents
- 349
- Published applications
- 439
- Assignees
- 127
- Inventors
- 630
- Latest grant
- 1 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 2 | 1 |
| 2003 | 1 | 4 |
| 2004 | 2 | 13 |
| 2005 | 9 | 20 |
| 2006 | 7 | 11 |
| 2007 | 9 | 16 |
| 2008 | 5 | 23 |
| 2009 | 11 | 17 |
| 2010 | 19 | 18 |
| 2011 | 15 | 20 |
| 2012 | 16 | 20 |
| 2013 | 21 | 24 |
| 2014 | 18 | 23 |
| 2015 | 31 | 34 |
| 2016 | 21 | 46 |
| 2017 | 31 | 38 |
| 2018 | 35 | 24 |
| 2019 | 16 | 18 |
| 2020 | 25 | 17 |
| 2021 | 20 | 11 |
| 2022 | 9 | 8 |
| 2023 | 8 | 11 |
| 2024 | 4 | 12 |
| 2025 | 8 | 6 |
| 2026 | 3 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Process for manufacturing a micro-electro-mechanical device including two chambers at different pressures and related micro-electro-mechanical device1 Sep 2026US 12,722,969 B2STMicroelectronics S,r.l.
- Inertial sensor, method for manufacturing inertial sensor, and inertial measurement unit19 May 2026US 12,631,665 B2Seiko Epson Corporation
- Method for manufacturing semiconductor structure17 Mar 2026US 12,577,099 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Laser sealing methods for closing ventholes of micromecahnical devices30 Dec 2025US 12,509,346 B2Robert Bosch GmbH
- Post CMP processing for hybrid bonding2 Sep 2025US 12,406,959 B2Adeia Semiconductor Bonding Technologies Inc.
- Manufacturing method for microelectromechanical devices and microelectromechanical device thereof20 Aug 2026US 2026/0242211 A1STMicroelectronics International N. V.
- Manufacturing process of a microelectromechanical system with multiple cavities at different pressures and related microelectromechanical system20 Aug 2026US 2026/0242215 A1STMicroelectronics International N. V.
- Pressure sensor having high detection performance and optimized manufacturing30 Apr 2026US 2026/0118197 A1STMicroelectronics International N. V.
- Device encapsulation using physical vapor deposition5 Feb 2026US 2026/0035238 A1
- Post cmp processing for hybrid bonding27 Nov 2025US 2025/0364481 A1Adeia Semiconductor Bonding Technologies Inc.
Most cited
By later US patents
- Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips273US 9,368,429 B2Intel Corporation · 2016
- Wafer-level MEMS packaging205US 6,635,509 B1DALSA Semiconductor Inc. · 2003
- Polysilicon resonating beam transducers and method of producing the same105US 5,188,983 AWisconsin Alumni Research Foundation · 1993
- Planar microshells for vacuum encapsulated devices and damascene method of manufacture94US 7,923,790 B1Silicon Laboratories Inc. · 2011
- Sealed cavity semiconductor pressure transducers and method of producing the same90US 4,853,669 AWisconsin Alumni Research Foundation · 1989