B81C 2201/0174
For making multi-layered devices, film deposition or growing
Official title: for making multi-layered devices, film deposition or growing
B81C2201/0174 (For making multi-layered devices, film deposition or growing) appears on 1,125 US grants and 1,418 published applications in this corpus.
Search patents in B81C- Granted patents
- 1,125
- Published applications
- 1,418
- Assignees
- 539
- Inventors
- 2,581
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 5 | 0 |
| 1997 | 1 | 0 |
| 1998 | 5 | 0 |
| 1999 | 5 | 0 |
| 2000 | 21 | 0 |
| 2001 | 16 | 14 |
| 2002 | 31 | 53 |
| 2003 | 36 | 47 |
| 2004 | 45 | 67 |
| 2005 | 33 | 39 |
| 2006 | 30 | 51 |
| 2007 | 40 | 48 |
| 2008 | 32 | 63 |
| 2009 | 21 | 56 |
| 2010 | 40 | 52 |
| 2011 | 38 | 55 |
| 2012 | 36 | 48 |
| 2013 | 36 | 50 |
| 2014 | 47 | 55 |
| 2015 | 58 | 56 |
| 2016 | 53 | 75 |
| 2017 | 65 | 81 |
| 2018 | 53 | 54 |
| 2019 | 57 | 51 |
| 2020 | 54 | 68 |
| 2021 | 45 | 62 |
| 2022 | 48 | 32 |
| 2023 | 45 | 61 |
| 2024 | 46 | 58 |
| 2025 | 40 | 68 |
| 2026 | 33 | 54 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- B81C 2201/019Bonding or gluing multiple substrate layersIndexing code483
- B81C 2201/0191Transfer of a layer from a carrier wafer to a device waferIndexing code209
- B81C 2201/0176Chemical vapour depositionIndexing code181
- B81C 2201/0183Selective depositionIndexing code144
- B81C 2201/0181Physical vapour deposition [pvd], i.e. evaporation, sputtering, ion plating or plasma assistedIndexing code95
- B81C 2201/0197Processes for making multi-layered devices not provided for in groups b81c2201/0176 -Indexing code77
Recent patents
- MEMS structure including a buried cavity with antistiction protuberances, and manufacturing methods thereof6 Oct 2026US 12,753,067 B2STMicroelectronics S,r.l.
- Micro-electro-mechanical system and manufacturing method thereof29 Sep 2026US 12,747,154 B2Beijing BOE Technology Development Co., Ltd.
- Microscale flexible strain sensor8 Sep 2026US 12,729,106 B2Carnegie Mellon University
- Anchor structure8 Sep 2026US 12,729,107 B2Lawrence Semiconductor Research Laboratory, Inc.
- MEMS sensor with a thin region1 Sep 2026US 12,726,773 B2Skyworks Solutions, Inc.
- Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device8 Oct 2026US 2026/0307983 A1
- Anchor structure1 Oct 2026US 2026/0296876 A1Lawrence Semiconductor Research Laboratory, Inc.
- Method for manufacturing a microelectromechanical component, and microelectromechanical component1 Oct 2026US 2026/0296882 A1
- Method of fabricating micro-electro-mechanical system package24 Sep 2026US 2026/0285676 A1Vanguard International Semiconductor Corporation
- Methods for fabrication of mems devices17 Sep 2026US 2026/0274654 A1Omnitron Sensors Inc.
Most cited
By later US patents
- Methods and devices for fabricating and assembling printable semiconductor elements883US 7,622,367 B1The Board of Trustees of the University of Illinois · 2009
- Stretchable semiconductor elements and stretchable electrical circuits765US 7,557,367 B2The Board of Trustees of the University of Illinois · 2009
- Microfluidic structure and process for its manufacture704US 5,376,252 APharmacia Biosensor AB · 1994
- Microfabricated elastomeric valve and pump systems619US 6,408,878 B1California Institute of Technology · 2002
- Optical systems fabricated by printing-based assembly564US 7,972,875 B2The Board of Trustees of the University of Illinois · 2011