B81C 2201/0191
Transfer of a layer from a carrier wafer to a device wafer
B81C2201/0191 (Transfer of a layer from a carrier wafer to a device wafer) appears on 209 US grants and 210 published applications in this corpus.
Search patents in B81C- Granted patents
- 209
- Published applications
- 210
- Assignees
- 113
- Inventors
- 409
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 3 | 0 |
| 2000 | 12 | 0 |
| 2001 | 6 | 1 |
| 2002 | 6 | 7 |
| 2003 | 8 | 4 |
| 2004 | 5 | 8 |
| 2005 | 3 | 4 |
| 2006 | 4 | 9 |
| 2007 | 6 | 6 |
| 2008 | 7 | 8 |
| 2009 | 1 | 12 |
| 2010 | 8 | 10 |
| 2011 | 5 | 10 |
| 2012 | 5 | 4 |
| 2013 | 13 | 6 |
| 2014 | 7 | 14 |
| 2015 | 13 | 16 |
| 2016 | 12 | 11 |
| 2017 | 9 | 9 |
| 2018 | 9 | 13 |
| 2019 | 9 | 6 |
| 2020 | 7 | 13 |
| 2021 | 8 | 12 |
| 2022 | 12 | 7 |
| 2023 | 9 | 6 |
| 2024 | 5 | 4 |
| 2025 | 7 | 6 |
| 2026 | 5 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for manufacturing a structure comprising a plurality of membranes overhanging cavities25 Aug 2026US 12,715,764 B2Commissariat A L'energie Atomique Et Aux Energies
- Attachable microphone and manufacturing method therefor21 Jul 2026US 12,686,612 B2Center for Advanced Soft Electronics
- Systems and methods for fabricating a 2D-material-based quantum sensor chip14 Jul 2026US 12,685,199 B2Toyota Jidosha Kabushiki Kaisha
- Method of liquid-mediated pattern transfer and device structure formed by liquid-mediated pattern transfer17 Mar 2026US 12,577,100 B2The Board of Trustees of the University of Illinois
- Method for transferring a thin layer onto a receiver substrate including cavities and a region devoid of cavities13 Jan 2026US 12,525,489 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Method for manufacturing a microelectromechanical component, and microelectromechanical component1 Oct 2026US 2026/0296882 A1
- Method for manufacturing an electronic device11 Jun 2026US 2026/0159381 A1Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Microfluidic devices and methods of producing5 Feb 2026US 2026/0034315 A1Invox Belgium NV
- Membrane transfer method22 Jan 2026US 2026/0022010 A1Soitec
- Process for producing a plurality of mems transducers with elevated performance capability20 Nov 2025US 2025/0358579 A1Hahn-Schickard-Gesellschaft FüR Angewandte Forschung E. V.
Most cited
By later US patents
- Controlled cleavage process and device for patterned films426US 5,985,742 ASilicon Genesis Corporation · 1999
- Controlled cleavage process and device for patterned films344US 6,528,391 B1Silicon Genesis Corporation · 2003
- Heterogeneously integrated microsystem-on-a-chip337US 7,335,972 B2Sandia Corporation · 2008
- Release strategies for making transferable semiconductor structures, devices and device components321US 7,932,123 B2The Board of Trustees of the University of Illinois · 2011
- Processes for lift-off of thin film materials or devices for fabricating three dimensional integrated circuits, optical detectors, and micromechanical devices287US 5,401,983 AGeorgia Tech Research Corporation · 1995