Method of liquid-mediated pattern transfer and device structure formed by liquid-mediated pattern transfer
AssigneeThe Board of Trustees of the University of Illinois
InventorsSeok Kim, Jun Kyu Park
Life of this patent
Estimating the term…
Abstract
A method of liquid-mediated pattern transfer includes providing a substrate comprising (a) a semiconductor film adhered to the substrate and (b) a first patterned layer on the semiconductor film. The substrate is submerged in a delamination liquid, whereby the semiconductor film is delaminated from the substrate while the first patterned layer remains on the semiconductor film. A patterned semiconductor membrane ready for transfer is thus obtained. The patterned semiconductor membrane is transferred to a target substrate in a transfer liquid, and then the transfer liquid is removed (e.g., evaporated). The patterned semiconductor membrane adheres to the target substrate as the transfer liquid is removed.
Claims12
A method of liquid-mediated pattern transfer, the method comprising:
- providing a substrate including:
- a semiconductor film adhered to the substrate;
- and
- a first patterned layer on the semiconductor film;
- submerging the substrate in a delamination liquid, whereby the semiconductor film is delaminated from the substrate while the first patterned layer remains on the semiconductor film, thereby obtaining a patterned semiconductor membrane ready for transfer;
- transferring the patterned semiconductor membrane to a target substrate in a transfer liquid;
- and
- removing the transfer liquid, the patterned semiconductor membrane adhering to the target substrate as the transfer liquid is removed,
- wherein the target substrate includes a hydrophilic region thereon, and
- wherein the hydrophilic region promotes alignment of the patterned silicon membrane on the target substrate as the transfer liquid is removed.
A method of liquid-mediated pattern transfer, the method comprising:
- providing a substrate including:
- a semiconductor film adhered to the substrate;
- and
- a first patterned layer on the semiconductor film;
- submerging the substrate in a delamination liquid, whereby the semiconductor film is delaminated from the substrate while the first patterned layer remains on the semiconductor film, thereby obtaining a patterned semiconductor membrane ready for transfer;
- transferring the patterned semiconductor membrane to a target substrate in a transfer liquid;
- removing the transfer liquid, the patterned semiconductor membrane adhering to the target substrate as the transfer liquid is removed;
- prior to transferring the patterned semiconductor membrane to the target substrate:
- transferring the patterned semiconductor membrane to a mediator substrate for further processing, the transfer to the mediator substrate taking place in the transfer liquid, and
- removing the transfer liquid, the patterned semiconductor membrane adhering to the mediator substrate as the transfer liquid is removed;
- and
- after the transfer to the mediator substrate, forming a second patterned layer on the patterned semiconductor membrane.
Dependencies are inferred from the claim text.