B81C 2201/0194
The layer being structured
Official title: the layer being structured
B81C2201/0194 (The layer being structured) appears on 65 US grants and 75 published applications in this corpus.
Search patents in B81C- Granted patents
- 65
- Published applications
- 75
- Assignees
- 61
- Inventors
- 184
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 2 |
| 2012 | 1 | 2 |
| 2013 | 2 | 3 |
| 2014 | 4 | 9 |
| 2015 | 9 | 11 |
| 2016 | 6 | 9 |
| 2017 | 5 | 4 |
| 2018 | 7 | 5 |
| 2019 | 2 | 3 |
| 2020 | 3 | 9 |
| 2021 | 6 | 5 |
| 2022 | 8 | 4 |
| 2023 | 3 | 1 |
| 2024 | 3 | 2 |
| 2025 | 3 | 5 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing a structure comprising a plurality of membranes overhanging cavities25 Aug 2026US 12,715,764 B2Commissariat A L'energie Atomique Et Aux Energies
- Method of liquid-mediated pattern transfer and device structure formed by liquid-mediated pattern transfer17 Mar 2026US 12,577,100 B2The Board of Trustees of the University of Illinois
- Chip package18 Nov 2025US 12,473,197 B2Xintec Inc.
- Nanostructure transfer method10 Jun 2025US 12,325,629 B2Centre National De La Recherche Scientifique
- Method for sealing cavities using membranes25 Feb 2025US 12,234,144 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Process for producing a plurality of mems transducers with elevated performance capability20 Nov 2025US 2025/0358579 A1Hahn-Schickard-Gesellschaft FüR Angewandte Forschung E. V.
- Actuator layer deposition and transfer2 Oct 2025US 2025/0304434 A1InvenSense, Inc.
- Cartridge with internal pillar2 Oct 2025US 2025/0304435 A1VueReal Inc.
- Hierarchical wavy structured surfaces and method of making thereof24 Jul 2025US 2025/0236510 A1University of Massachusetts
- Process and device for assembly of van der waals heterostructures30 Jan 2025US 2025/0033339 A1The University of Manchester
Most cited
By later US patents
- Processes for lift-off of thin film materials or devices for fabricating three dimensional integrated circuits, optical detectors, and micromechanical devices287US 5,401,983 AGeorgia Tech Research Corporation · 1995
- Micro device transfer head with silicon electrode101US 8,415,771 B1LuxVue Technology Corporation · 2013
- Quartz-based MEMS resonators and methods of fabricating same30US 8,765,615 B1HRL Laboratories, LLC · 2014
- Method of fabricating a dual single-crystal backplate microphone17US 8,590,136 B2Analog Devices, Inc. · 2013
- Systems and methods for laser splitting and device layer transfer16US 9,214,353 B2Solexel, Inc. · 2015