Nanostructure transfer method
AssigneesThales Solutions Asia Pte Ltd, Centre National De La Recherche Scientifique, Nanyang Technological University, Universite De Lille
InventorsJianxiong Wang, Philippe Coquet, Beng Kang Tay
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Abstract
A nanostructure transfer method is provided. The method includes providing a first substrate (10) having thereon a plurality of nanostructures (12), the nanostructures (12) extending away from the first substrate (10). A solder material (14) is deposited on distal ends of the nanostructures (12). A second substrate (18) having thereon a first metal layer (20) is provided. The solder material (14) is bonded to the first metal layer (20), thereby attaching the nanostructures (12) to the second substrate (18). The attached nanostructures (12) are then released from the first substrate (10).
Claims22
A nanostructure transfer method, comprising:
- providing a plurality of first nanostructures, and a plurality of second nanostructures, the first nanostructures and the second nanostructures extending to a respective first height and second height, the second height being greater than the first height;
- depositing a solder material on distal ends of the first nanostructures;
- providing a target substrate having thereon a first metal layer;
- bonding the solder material on the distal ends of the first nanostructures to the first metal layer, thereby attaching the first nanostructures to the target substrate;
- depositing a solder material on the distal ends of the second nanostructures;
- bonding the solder material on the distal ends of the second nanostructures to the first metal layer, thereby attaching the second nanostructures to the target substrate;
- wherein the first and second nanostructures are transferred in a sequence of increasing height, and,
- wherein the first nanostructures and the second nanostructures are one-dimensional nanostructures.
Dependencies are inferred from the claim text.