Process and device for assembly of van der waals heterostructures

Abstract

Provided herein is a method for transferring a material from a first substrate to a second substrate via a flexible intermediate substrate comprising a support layer and a metallic adhesion layer. The method comprises lifting the material from the first substrate with the intermediate substrate, the lifting comprising adhering the material to the metallic adhesion layer by Van der Waals adhesion between the material and the metallic adhesion layer. The method comprises depositing the material from the intermediate substrate on to the second substrate, the depositing comprising adhering the material to the second substrate by Van der Waals adhesion between the material and the second substrate. Also provided herein is a method of forming a heterostructure by removing material from one or more substrates via a flexible intermediate substrate comprising a support layer and metallic adhesion layer. A flexible substrate for performing the same is also provided.

Dependencies are inferred from the claim text.