B81C 2201/0195
The layer being unstructured
Official title: the layer being unstructured
B81C2201/0195 (The layer being unstructured) appears on 25 US grants and 27 published applications in this corpus.
Search patents in B81C- Granted patents
- 25
- Published applications
- 27
- Assignees
- 19
- Inventors
- 54
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2012 | 1 | 1 |
| 2013 | 1 | 0 |
| 2014 | 0 | 1 |
| 2015 | 1 | 4 |
| 2016 | 4 | 1 |
| 2017 | 2 | 3 |
| 2018 | 2 | 4 |
| 2019 | 6 | 2 |
| 2020 | 1 | 1 |
| 2021 | 0 | 2 |
| 2022 | 0 | 2 |
| 2023 | 2 | 1 |
| 2024 | 1 | 2 |
| 2025 | 2 | 2 |
| 2026 | 2 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for manufacturing a structure comprising a plurality of membranes overhanging cavities25 Aug 2026US 12,715,764 B2Commissariat A L'energie Atomique Et Aux Energies
- Systems and methods for fabricating a 2D-material-based quantum sensor chip14 Jul 2026US 12,685,199 B2Toyota Jidosha Kabushiki Kaisha
- Membrane transfer method21 Oct 2025US 12,448,284 B2Soitec
- Method for sealing cavities using membranes25 Feb 2025US 12,234,144 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Method of manufacturing an integrated capacitor structure using a donor substrate for transferring layers to a receiver substrate9 Jan 2024US 11,865,580 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Membrane transfer method22 Jan 2026US 2026/0022010 A1Soitec
- Process for producing a plurality of mems transducers with elevated performance capability20 Nov 2025US 2025/0358579 A1Hahn-Schickard-Gesellschaft FüR Angewandte Forschung E. V.
- Process and device for assembly of van der waals heterostructures30 Jan 2025US 2025/0033339 A1The University of Manchester
- Systems and methods for fabricating a 2-d-material-based quantum sensor chip5 Dec 2024US 2024/0402263 A1Toyota Jidosha Kabushiki Kaisha
- Method for manufacturing a structure comprising a plurality of membranes overlooking cavities11 Jan 2024US 2024/0010491 A1Commissariat A L'energie Atomique Et Aux Energies
Most cited
By later US patents
- Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same74US 9,242,275 B2Butterfly Networks, Inc. · 2016
- Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same48US 9,061,318 B2Butterfly Network, Inc. · 2015
- Method of forming MEMS device with weakened substrate45US 8,241,931 B1Analog Devices, Inc. · 2012
- Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same39US 9,290,375 B2Butterfly Network, Inc. · 2016
- Complementary metal oxide semiconductor (CMOS) ultrasonic transducers and methods for forming the same31US 9,499,395 B2Butterfly Network, Inc. · 2016